Kioxia corporation (20240098930). SEMICONDUCTOR STORAGE DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR STORAGE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR STORAGE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR STORAGE DEVICE
Organization Name
Inventor(s)
Keishi Shimizu of Yokohama Kanagawa (JP)
SEMICONDUCTOR STORAGE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240098930 titled 'SEMICONDUCTOR STORAGE DEVICE
Simplified Explanation
The semiconductor storage device described in the patent application includes a housing, a substrate, a first semiconductor component, a capacitor, and a first regulating plate. The substrate is housed within the housing, with the first semiconductor component mounted on it. The capacitor is positioned on the substrate, overlapping the first semiconductor component from the opposite side of the substrate. The first regulating plate directs airflow inside the housing towards the gap between the capacitor and the substrate.
- Housing with substrate and semiconductor component
- Capacitor overlapping semiconductor component
- Regulating plate guiding airflow towards capacitor-substrate gap
Potential Applications
This technology could be applied in various semiconductor storage devices, such as solid-state drives, memory modules, and flash drives.
Problems Solved
1. Improved cooling efficiency for semiconductor components 2. Enhanced performance and reliability of storage devices
Benefits
1. Increased longevity of semiconductor components 2. Better thermal management for improved device performance
Potential Commercial Applications
Optimizing thermal management in data centers Enhancing storage device performance in consumer electronics
Possible Prior Art
Prior art may include patents related to thermal management in semiconductor devices, capacitor positioning for improved performance, and regulating airflow in electronic components.
Unanswered Questions
How does this technology compare to existing cooling solutions in semiconductor devices?
This article does not provide a direct comparison to existing cooling solutions in semiconductor devices. It would be beneficial to understand the specific advantages and disadvantages of this technology in relation to traditional cooling methods.
What impact does the capacitor-substrate gap have on the overall performance of the storage device?
The article does not delve into the specific effects of the capacitor-substrate gap on the performance of the storage device. Further research or testing may be needed to determine the significance of this gap in relation to device functionality and efficiency.
Original Abstract Submitted
a semiconductor storage device includes a housing, a substrate, a first semiconductor component, a capacitor, and a first regulating plate. the substrate is accommodated in the housing. the first semiconductor component is mounted on the substrate. the capacitor on the substrate, the capacitor includes a portion that overlaps the first semiconductor component from a side opposite to the substrate when viewed in a first direction, which is a thickness direction of the substrate. the first regulating plate guides at least a part of air, which flows inside the housing, toward a gap between the capacitor and the substrate.
