18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Wensen Hung of Zhubei City (TW)
Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18150853 titled 'Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same
Simplified Explanation
The method described in the patent application involves attaching a permeable plate, made of a metallic material, to a metal lid. A liquid-metal-comprising media, which contains a liquid metal, is dispensed onto a first package component. The first package component is then bonded to a second package component. The metal lid is attached to the second package component, and during this process, the liquid-metal-comprising media migrates into the permeable plate, forming a composite thermal interface material.
- The method involves attaching a permeable plate to a metal lid.
- The permeable plate is made of a metallic material.
- A liquid-metal-comprising media, containing a liquid metal, is dispensed onto a first package component.
- The first package component is bonded to a second package component.
- The metal lid is attached to the second package component.
- During the attachment process, the liquid-metal-comprising media migrates into the permeable plate.
- This migration forms a composite thermal interface material.
Potential Applications:
- Electronics packaging industry
- Thermal management in electronic devices
- Heat dissipation in high-performance computing systems
Problems Solved:
- Improving thermal management in electronic devices
- Enhancing heat dissipation capabilities
- Addressing thermal issues in high-performance computing systems
Benefits:
- Improved thermal conductivity
- Enhanced heat dissipation efficiency
- Increased reliability and lifespan of electronic devices
- Better performance in high-performance computing systems
Original Abstract Submitted
A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.
