18338933. IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

KYONGSOON Cho of Suwon-Si (KR)

IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18338933 titled 'IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE

Simplified Explanation

The abstract describes an image sensor package that includes a package substrate, a logic chip, an image sensor chip, a bonding wire, a dam structure, a cover glass, and an encapsulation structure. The logic chip is mounted on the package substrate and has a central region and an edge region. The image sensor chip is mounted on the central region of the logic chip. The bonding wire electrically interconnects the package substrate to the logic chip and is bonded to the edge region of the logic chip. The dam structure is disposed in the edge region of the logic chip to cover a portion of the bonding wire. The cover glass is disposed on the dam structure, and the encapsulation structure encapsulates the bonding wire on the package substrate.

  • The package substrate provides a base for the image sensor package.
  • The logic chip is mounted on the package substrate and has a central region and an edge region.
  • The image sensor chip is mounted on the central region of the logic chip.
  • The bonding wire electrically connects the package substrate to the logic chip and is bonded to the edge region of the logic chip.
  • The dam structure is placed in the edge region of the logic chip to cover a portion of the bonding wire.
  • The cover glass is placed on the dam structure to protect the bonding wire.
  • The encapsulation structure encapsulates the bonding wire on the package substrate to provide further protection.

Potential applications of this technology:

  • Image sensor packages can be used in various electronic devices such as smartphones, digital cameras, and surveillance systems.
  • The encapsulation structure provides protection to the bonding wire, ensuring reliable performance of the image sensor chip.
  • The dam structure and cover glass protect the bonding wire from external elements, enhancing the durability of the image sensor package.

Problems solved by this technology:

  • The dam structure and cover glass prevent damage to the bonding wire, reducing the risk of electrical failures.
  • The encapsulation structure provides a barrier against moisture, dust, and other contaminants, improving the longevity of the image sensor package.

Benefits of this technology:

  • Enhanced reliability and durability of image sensor packages.
  • Improved performance and longevity of electronic devices utilizing image sensor packages.
  • Protection against external elements, ensuring consistent and accurate image capture.


Original Abstract Submitted

An image sensor package includes a package substrate, a logic chip mounted on the package substrate and having a central region and an edge region, an image sensor chip mounted on the central region of the logic chip, a bonding wire electrically interconnecting the package substrate to the logic chip and bonded to the edge region of the logic chip, a dam structure disposed in the edge region of the logic chip to cover a portion of the bonding wire, a cover glass disposed on the dam structure, and an encapsulation structure encapsulating the bonding wire on the package substrate.

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