17622884. DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)

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DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME

Organization Name

TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor(s)

Bin Zhao of Huizhou, Guangdong (CN)

Juncheng Xiao of Huizhou, Guangdong (CN)

Xiaodan Lin of Huizhou, Guangdong (CN)

DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17622884 titled 'DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME

Simplified Explanation

The abstract describes a display panel and a method for manufacturing the same. The display panel consists of a first bonding area and a second bonding area connected to the first bonding area. The panel also includes a substrate and a bonding wiring layer. The thickness of the substrate in the second bonding area is less than the thickness in the first bonding area. The bonding wiring layer is placed on the surfaces of the substrate in both bonding areas. The side surface of the bonding wiring layer and the side surface of the substrate, away from the first bonding area, are located on the same plane.

  • The display panel has a first bonding area and a second bonding area connected to it.
  • The substrate in the second bonding area is thinner than in the first bonding area.
  • A bonding wiring layer is present on the surfaces of the substrate in both bonding areas.
  • The side surface of the bonding wiring layer and the side surface of the substrate, away from the first bonding area, are on the same plane.

Potential Applications:

  • This technology can be used in the manufacturing of display panels for electronic devices such as smartphones, tablets, and televisions.
  • It can improve the overall performance and functionality of the display panels.

Problems Solved:

  • The technology solves the problem of uneven thickness in the substrate of a display panel.
  • It ensures that the bonding wiring layer is properly placed on the substrate surfaces in both bonding areas.

Benefits:

  • The display panel manufactured using this technology will have a more uniform thickness, leading to improved structural integrity.
  • The technology allows for better bonding between the substrate and the bonding wiring layer.
  • It can enhance the overall quality and reliability of the display panel.


Original Abstract Submitted

A display panel and a method for manufacturing the same are provided. The display panel includes a first bonding area and a second bonding area connected to the first bonding area. The display panel further includes a substrate and a bonding wiring layer. A thickness of a part of the substrate in the second bonding area is less than a thickness of a part of the substrate in the first bonding area. The bonding wiring layer is disposed on surfaces of the parts of the substrate in the first bonding area and the second bonding area. A side surface of the bonding wiring layer away from the first bonding area and a side surface of the substrate away from the first bonding area are located on a same plane.

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