17809039. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Ban-Li Wu of Hsinchu (TW)

Tsung-Hsien Chiang of Hsinchu (TW)

Tzu-Sung Huang of Tainan City (TW)

Chao-Hsien Huang of Kaohsiung City (TW)

Chia-Lun Chang of Tainan City (TW)

Hsiu-Jen Lin of Zhubei City (TW)

Ming Hung Tseng of Toufen Township (TW)

Hao-Yi Tsai of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17809039 titled 'SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation

The abstract describes a semiconductor package that includes heat dissipation systems and a method of forming it. The package consists of integrated circuit dies, an encapsulant, and a redistribution structure. The redistribution structure has heat dissipation systems that are electrically isolated from the rest of the structure. Each heat dissipation system includes metal pads and metal vias connecting them.

• The semiconductor package includes one or more heat dissipation systems.
• The package contains integrated circuit dies, an encapsulant, and a redistribution structure.
• The redistribution structure has heat dissipation systems that are electrically isolated.
• Each heat dissipation system consists of metal pads and metal vias connecting them.

Potential Applications

• This technology can be used in various electronic devices that require efficient heat dissipation, such as smartphones, laptops, and servers.
• It can be applied in high-performance computing systems, where heat management is crucial for optimal performance.
• The semiconductor package can be used in automotive electronics to ensure reliable operation under high-temperature conditions.

Problems Solved

• The heat dissipation systems in the semiconductor package address the issue of excessive heat generation in integrated circuits, which can lead to performance degradation and even failure.
• By providing electrically isolated heat dissipation systems, the package prevents interference with other components and ensures reliable operation.

Benefits

• The heat dissipation systems in the semiconductor package improve the overall thermal management of the integrated circuits, enhancing their performance and longevity.
• The electrically isolated heat dissipation systems prevent electrical interference and improve the reliability of the package.
• The method of forming the semiconductor package allows for efficient and cost-effective manufacturing processes.

Original Abstract Submitted

A semiconductor package including one or more heat dissipation systems and a method of forming are provided. The semiconductor package may include one or more integrated circuit dies, an encapsulant surrounding the one or more integrated circuit dies, a redistribution structure over the one or more integrated circuit dies and the encapsulant. The redistribution structure may include one or more heat dissipation systems, which are electrically isolated from remaining portions of the redistribution structure. Each heat dissipation system may include a first metal pad, a second metal pad, and one or more metal vias connecting the first metal pad to the second metal pad.