17725163. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17725163 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes a redistribution substrate, a semiconductor chip, and two passive devices. The package also includes connection terminals and an underfill layer.
- The semiconductor package includes a redistribution substrate, which is a layer that redistributes the electrical connections on the chip to the connection terminals.
- The semiconductor chip is mounted on the top surface of the redistribution substrate.
- There are two passive devices located on the bottom surface of the redistribution substrate, and they are spaced apart from each other.
- The connection terminals are located on the bottom surface of the redistribution substrate and provide electrical connections to the outside world.
- An underfill layer is present between the passive devices and the redistribution substrate, and it extends in a specific direction.
- The bottom surface of the redistribution substrate is exposed between each passive device and the closest connection terminal in the opposite direction.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be used in automotive electronics, medical devices, and industrial equipment.
Problems solved by this technology:
- The semiconductor package provides a compact and efficient way to connect the semiconductor chip and passive devices.
- The underfill layer helps to protect the connections and improve the reliability of the package.
Benefits of this technology:
- The semiconductor package allows for a more efficient use of space, as the passive devices are located on the bottom surface of the redistribution substrate.
- The underfill layer improves the reliability of the package by providing additional protection to the connections.
- The exposed bottom surface of the redistribution substrate allows for easier access to the connection terminals.
Original Abstract Submitted
Provided is a semiconductor package including a redistribution substrate, a semiconductor chip on a top surface of the redistribution substrate, a first passive device and a second passive device on a bottom surface of the redistribution substrate and spaced apart, connection terminals on the bottom surface of the redistribution substrate, and an underfill layer between the first passive device and the redistribution substrate and between the second passive device and the redistribution substrate, the underfill layer intersecting a region between the first passive device and the second passive device and extending in the first direction, wherein the bottom surface of the redistribution substrate is exposed between the first passive device and a first connection terminal closest to the first passive device in the first direction, and between the second passive device and a second connection terminal closest to the second passive device in an opposite direction to the first direction.
