17920340. DISPLAY SUBSTRATE, METHOD FOR PREPARING DISPLAY SUBSTRATE, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

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DISPLAY SUBSTRATE, METHOD FOR PREPARING DISPLAY SUBSTRATE, AND DISPLAY DEVICE

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Tianhao Lu of Beijing (CN)

Dejiang Zhao of Beijing (CN)

Qian Sun of Beijing (CN)

Wei Huang of Beijing (CN)

DISPLAY SUBSTRATE, METHOD FOR PREPARING DISPLAY SUBSTRATE, AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17920340 titled 'DISPLAY SUBSTRATE, METHOD FOR PREPARING DISPLAY SUBSTRATE, AND DISPLAY DEVICE

Simplified Explanation

The patent application describes a method to improve the stability of a QD-LED device by increasing the contact area and binding force between a planarization layer and an inorganic insulating layer. This is achieved by forming multiple recesses on the insulating layer, which do not overlap with the LEDs on the driving substrate. When the planarization layer is formed on the LEDs, it fills the recesses, increasing the contact area and reducing the risk of peeling off.

  • Multiple recesses are formed on the insulating layer facing the LEDs.
  • The recesses do not overlap with the LEDs on the driving substrate.
  • A planarization layer is formed on the LEDs, covering them.
  • The recesses are filled with the planarization layer, increasing the contact area.
  • The binding force between the planarization layer and the insulating layer is increased.
  • The risk of peeling off the planarization layer is reduced, improving device stability.

Potential Applications

  • Quantum dot light-emitting diode (QD-LED) devices
  • Display technology
  • Lighting technology

Problems Solved

  • Low contact area between planarization layer and insulating layer
  • Weak binding force between planarization layer and insulating layer
  • Risk of peeling off the planarization layer

Benefits

  • Increased contact area between planarization layer and insulating layer
  • Improved binding force between planarization layer and insulating layer
  • Reduced risk of peeling off the planarization layer
  • Enhanced stability of QD-LED devices


Original Abstract Submitted

Multiple first recesses are formed on the side of an inorganic insulating layer facing towards multiple LEDs. Orthographic projections of the first recesses on a driving substrate do not overlap orthographic projections of the LEDs on the driving substrate. Thus, when a first planarization layer covering the multiple LEDs is formed on the side of the multiple LEDs facing away from the driving substrate, the first recesses can be filled with the first planarization layer, so that a contact area between the first planarization layer and the inorganic insulating layer can be increased, a binding force between the first planarization layer and the inorganic insulating layer can be increased, and the risk of peeling off the first planarization layer can be reduced, thereby improving the stability of a QD-LED device.