17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
Contents
- 1 HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Haobo Chen of Chandler AZ (US)
Changhua Liu of Chandler AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17957003 titled 'HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
Simplified Explanation
The patent application describes microelectronics package architectures that incorporate high surface area capacitors within the substrate packages. The substrates consist of an anode material, a cathode material, and a conductive material. The anode material features peaks and valleys, while the cathode material has complementary peaks and valleys. The conductive material is located at the anode peaks.
- Anode material with peaks and valleys
- Cathode material with complementary peaks and valleys
- Conductive material at anode peaks
Potential Applications
The technology could be applied in:
- Microelectronics packaging
- Energy storage devices
- Power management systems
Problems Solved
The innovation addresses issues such as:
- Increasing surface area for capacitors
- Enhancing energy storage capacity
- Improving power efficiency
Benefits
The technology offers benefits like:
- Higher capacitance
- Improved performance
- Enhanced reliability
Potential Commercial Applications
The technology could find use in:
- Consumer electronics
- Automotive industry
- Renewable energy sector
Possible Prior Art
One possible prior art could be the use of traditional capacitors in microelectronics packaging.
Unanswered Questions
How does this technology compare to existing capacitor designs in terms of performance and efficiency?
The article does not provide a direct comparison with traditional capacitor designs.
What are the potential challenges in implementing this technology on a large scale in manufacturing processes?
The article does not address the potential challenges in large-scale implementation of the technology.
Original Abstract Submitted
Disclosed herein are microelectronics package architectures utilizing in-situ high surface area capacitor in substrate packages and methods of manufacturing the same. The substrates may include an anode material, a cathode material, and a conductive material. The anode material may have an anode surface that may define a plurality of anode peaks and anode valleys. The cathode material may have a cathode surface that may define a plurality of cathode peaks and cathode valleys complementary to the plurality of anode peaks and anode valleys. The conductive material may be located at the anode peaks.
