17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)

From WikiPatents
Jump to navigation Jump to search

COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES

Organization Name

Intel Corporation

Inventor(s)

Kavitha Nagarajan of Bangalore (IN)

Min Suet Lim of Gelugor (MY)

Eng Huat Goh of Ayer Itam (MY)

Telesphor Kamgaing of Chandler AZ (US)

Chee Kheong Yoon of Bayan Lepas (MY)

Jooi Wah Wong of Bukit Mertajam (MY)

Chu Aun Lim of Hillsboro OR (US)

COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17849352 titled 'COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES

Simplified Explanation

The abstract of this patent application describes electronic packages that consist of a die, a package substrate, a conductive ring, and balls outside of the ring. Here is a simplified explanation of the abstract:

  • An electronic package is disclosed.
  • The package includes a die, which is a small piece of semiconductor material.
  • The die is connected to a package substrate, which provides support and electrical connections.
  • A conductive ring is placed under the package substrate.
  • The ring is made of a material that can conduct electricity.
  • The electronic package also includes balls that are located outside of the ring.

Potential Applications of this Technology:

  • This technology can be used in various electronic devices such as smartphones, tablets, and computers.
  • It can be applied in the automotive industry for electronic components in vehicles.
  • It can be used in medical devices, aerospace systems, and other electronic equipment.

Problems Solved by this Technology:

  • The conductive ring helps in providing electrical connectivity and stability to the electronic package.
  • It prevents electrical interference and improves the overall performance of the package.
  • The balls outside of the ring facilitate the connection of the package to other components or circuit boards.

Benefits of this Technology:

  • The use of a conductive ring improves the reliability and durability of the electronic package.
  • It ensures proper electrical connections and reduces the risk of failures.
  • The design allows for efficient heat dissipation, which is crucial for electronic devices.
  • The technology enables the miniaturization of electronic packages, making them more compact and lightweight.


Original Abstract Submitted

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.

Retrieved from "http://wikipatents.org/index.php?title=17849352._COPPER_RINGS_FOR_BGA_COUNT_REDUCTION_IN_SMALL_FORM_FACTOR_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16650"