18167415. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Donghoon Gang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18167415 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes two semiconductor chips and a molding pattern. The first semiconductor chip has two surfaces, and the second semiconductor chip is connected to the second surface of the first chip. The molding pattern surrounds the side surfaces of both chips, but a portion of the first surface of the first chip is left uncovered. Additionally, a glass pattern is present on the uncovered portion of the first surface.
- The semiconductor package includes two semiconductor chips and a molding pattern.
- The first chip has two surfaces, and the second chip is connected to the second surface of the first chip.
- The molding pattern surrounds the side surfaces of both chips.
- A portion of the first surface of the first chip is left uncovered.
- A glass pattern is present on the uncovered portion of the first surface.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Provides a protective molding pattern for the semiconductor chips
- Allows for the integration of a glass pattern on the first chip's surface
Benefits
- Enhanced protection for the semiconductor chips
- Improved functionality and aesthetics with the addition of the glass pattern
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip having a first surface and a second surface opposite to each other, a second semiconductor chip on the second surface of the first semiconductor chip and electrically connected to the first semiconductor chip, and a molding pattern bordering side surfaces of the first semiconductor chip and side surfaces of the second semiconductor chip. At least a portion of the first surface of the first semiconductor chip is free of the molding pattern. A glass pattern is on the first surface of the first semiconductor chip.
