17747131. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yongkwan Lee of Hwaseong-si (KR)
Jungjoo Kim of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17747131 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, an interposer, conductive connectors, a semiconductor chip, and cooling patches. The cooling patches have cylindrical shapes and are made of the same material as the conductive connectors. The height of each cooling patch is equal to or less than its diameter, and they have higher thermal conductivity than the lower protective layer of the interposer.
- The semiconductor package includes a package substrate, interposer, conductive connectors, semiconductor chip, and cooling patches.
- The cooling patches have cylindrical shapes and are made of the same material as the conductive connectors.
- The height of each cooling patch is less than or equal to its diameter.
- The thermal conductivity of the cooling patches is higher than the thermal conductivity of the lower protective layer of the interposer.
Potential Applications
- This semiconductor package can be used in various electronic devices that require efficient cooling, such as computers, smartphones, and gaming consoles.
- It can be applied in high-performance computing systems, where heat dissipation is crucial for maintaining optimal performance.
Problems Solved
- The cooling patches help to dissipate heat generated by the semiconductor chip, preventing overheating and potential damage to the device.
- The use of cooling patches with higher thermal conductivity than the lower protective layer of the interposer improves the overall cooling efficiency of the semiconductor package.
Benefits
- Improved cooling efficiency ensures the longevity and reliability of the electronic device.
- The use of cooling patches made of the same material as the conductive connectors simplifies the manufacturing process.
- The cylindrical shape of the cooling patches allows for easy integration and placement within the semiconductor package.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes a package substrate, an interposer including a lower protective layer, conductive connectors connecting the package substrate to the interposer, a semiconductor chip arranged between the package substrate and the interposer, and cooling patches arranged between the semiconductor chip and the interposer and having cylindrical shapes, wherein each of the cooling patches includes the same material as each of the conductive connectors, a height of each of the cooling patches is less than or equal to a diameter of each of the cooling patches, and thermal conductivity of each of the cooling patches is greater than thermal conductivity of the lower protective layer.
