Taiwan Semiconductor Manufacturing Co., Ltd. patent applications published on February 1st, 2024
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Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on February 1st, 2024
- 1.1 MEMS Structure with Reduced Peeling and Methods Forming the Same (18151689)
- 1.2 Device And Method For Detecting Miniature Targets In A Fluid Sample (17876695)
- 1.3 Miniature-Target-Detecting Transistors With Different Gate Structures (17876819)
- 1.4 FLUIDIC CARTRIDGE MODULE, BIOSENSOR DEVICE, METHOD OF DETECTING ANALYTE IN SAMPLE (17873146)
- 1.5 Repackaging IC Chip For Fault Identification (18192745)
- 1.6 PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18125464)
- 1.7 PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18114126)
- 1.8 LOW-DROPOUT (LDO) REGULATOR WITH A FEEDBACK CIRCUIT (17877115)
- 1.9 APPARATUS AND METHOD FOR MAPPING FOUNDATIONAL COMPONENTS DURING DESIGN PORTING FROM ONE PROCESS TECHNOLOGY TO ANOTHER PROCESS TECHNOLOGY (18231762)
- 1.10 MULTIPLEXER (18345389)
- 1.11 SPACER FILM SCHEME FORM POLARIZATION IMPROVEMENT (18150281)
- 1.12 SENSE AMPLIFIER FOR COUPLING EFFECT REDUCTION (18447904)
- 1.13 READ ASSIST CIRCUIT FOR MEMORY DEVICE AND OPERATION METHOD THEREOF (17873686)
- 1.14 METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING (18298031)
- 1.15 METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN MONOCRYSTALLINE PHASE (17876036)
- 1.16 VACUUM CHUCK (17876381)
- 1.17 SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME (17875625)
- 1.18 Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification (18192770)
- 1.19 CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF (18333682)
- 1.20 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17876389)
- 1.21 SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME (18308982)
- 1.22 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17873170)
- 1.23 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (17874192)
- 1.24 Integrated Circuit Packages and Methods of Forming the Same (17815629)
- 1.25 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17876558)
- 1.26 Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same (18150853)
- 1.27 Semiconductor Device Packages and Methods of Forming the Same (17878647)
- 1.28 SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION (17816261)
- 1.29 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (17873180)
- 1.30 INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME (17877387)
- 1.31 INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME (17877350)
- 1.32 Architecture for Computing System Package (18355824)
- 1.33 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18481961)
- 1.34 SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION (17814997)
- 1.35 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF (18103676)
- 1.36 SEMICONDUCTOR DEVICE (18485291)
- 1.37 FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER (17814836)
- 1.38 Semiconductor Package and Method (17815088)
- 1.39 NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE (17816055)
- 1.40 PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF (18482743)
- 1.41 PACKAGE STRUCTURE (18481975)
- 1.42 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18314536)
- 1.43 IMAGE SENSOR DEVICE (18487216)
- 1.44 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING (17816257)
- 1.45 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (17815854)
- 1.46 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17876465)
- 1.47 SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES (18298629)
- 1.48 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17877970)
- 1.49 SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME (17875975)
- 1.50 GATE PROFILE TUNING FOR MULTIGATE DEVICE (18153700)
- 1.51 DEVICE WITH TAPERED INSULATION STRUCTURE AND RELATED METHODS (17876737)
- 1.52 METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH THIN FILM TRANSISTOR (18477068)
- 1.53 Thin-Film Transistors For Detecting Miniature Targets (17876920)
- 1.54 FIELD EFFECT TRANSISTOR WITH ISOLATION STRUCTURE AND METHOD (18170482)
- 1.55 SEMICONDUCTOR DETECTOR (18486114)
- 1.56 MULTIPLE SUPPLY VOLTAGE TRACKS AND STANDARD CELLS (17873952)
- 1.57 CLOCK SYNTHESIZER (17815775)
- 1.58 Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes (18191787)
- 1.59 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17876044)
- 1.60 MEMORY STRUCTURE (17815285)
- 1.61 FERROELECTRIC TUNNEL JUNCTION DEVICE (17815601)
- 1.62 FERROELECTRIC MEMORY DEVICE WITH BLOCKING LAYER (18150289)
- 1.63 MEMORY DEVICE AND SEMICONDUCTOR DIE, AND METHOD OF FABRICATING MEMORY DEVICE (18484466)
- 1.64 MEMORY DEVICE AND METHOD OF FORMING THE SAME (18152770)
- 1.65 Memory Device With Source Lines in Parallel (18447856)
- 1.66 MEMORY DEVICE AND FABRICATION METHOD THEREOF (17873166)
- 1.67 PHASE CHANGE RANDOM ACCESS MEMORY DEVICE (18231750)
Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on February 1st, 2024
MEMS Structure with Reduced Peeling and Methods Forming the Same (18151689)
Main Inventor
Pei-Wei Lee
Device And Method For Detecting Miniature Targets In A Fluid Sample (17876695)
Main Inventor
Wei Lee
Miniature-Target-Detecting Transistors With Different Gate Structures (17876819)
Main Inventor
Wei Lee
FLUIDIC CARTRIDGE MODULE, BIOSENSOR DEVICE, METHOD OF DETECTING ANALYTE IN SAMPLE (17873146)
Main Inventor
Yi-Hsing Hsiao
Repackaging IC Chip For Fault Identification (18192745)
Main Inventor
Chien-Yi Chen
PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18125464)
Main Inventor
Wei-Hao LEE
PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF (18114126)
Main Inventor
Pei-Cheng HSU
LOW-DROPOUT (LDO) REGULATOR WITH A FEEDBACK CIRCUIT (17877115)
Main Inventor
Zheng-Jun Lin
APPARATUS AND METHOD FOR MAPPING FOUNDATIONAL COMPONENTS DURING DESIGN PORTING FROM ONE PROCESS TECHNOLOGY TO ANOTHER PROCESS TECHNOLOGY (18231762)
Main Inventor
Chih-yuan Stephen YU
MULTIPLEXER (18345389)
Main Inventor
Chi-Lin Liu
SPACER FILM SCHEME FORM POLARIZATION IMPROVEMENT (18150281)
Main Inventor
Tzu-Yu Lin
SENSE AMPLIFIER FOR COUPLING EFFECT REDUCTION (18447904)
Main Inventor
Ku-Feng Lin
READ ASSIST CIRCUIT FOR MEMORY DEVICE AND OPERATION METHOD THEREOF (17873686)
Main Inventor
Yorinobu FUJINO
METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING (18298031)
Main Inventor
Yu-Ching Chiu
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN MONOCRYSTALLINE PHASE (17876036)
Main Inventor
Kai-Fang CHENG
VACUUM CHUCK (17876381)
Main Inventor
Po-Yo SU
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME (17875625)
Main Inventor
Kai-Fang CHENG
Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification (18192770)
Main Inventor
Kao-Chih Liu
CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF (18333682)
Main Inventor
Chung-Hao Cai
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17876389)
Main Inventor
Kuan-Kan HU
SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME (18308982)
Main Inventor
Yu-Ching Chiu
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17873170)
Main Inventor
Cheng-Chieh Li
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (17874192)
Main Inventor
Wensen Hung
Integrated Circuit Packages and Methods of Forming the Same (17815629)
Main Inventor
Ping-Yin Hsieh
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17876558)
Main Inventor
Kai-Fung Chang
Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same (18150853)
Main Inventor
Wensen Hung
Semiconductor Device Packages and Methods of Forming the Same (17878647)
Main Inventor
Chi-Yang Yu
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION (17816261)
Main Inventor
Ting-Ting KUO
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (17873180)
Main Inventor
Kuo-Chiang Tsai
INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME (17877387)
Main Inventor
Kai-Fang CHENG
INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME (17877350)
Main Inventor
Kai-Fang CHENG
Architecture for Computing System Package (18355824)
Main Inventor
Chen-Hua Yu
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18481961)
Main Inventor
Yung-Chi Chu
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION (17814997)
Main Inventor
Tien-Chung YANG
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF (18103676)
Main Inventor
Jen-Yuan Chang
SEMICONDUCTOR DEVICE (18485291)
Main Inventor
Zi-Jheng LIU
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER (17814836)
Main Inventor
Ting-Ting Kuo
Semiconductor Package and Method (17815088)
Main Inventor
Jeng-Nan Hung
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE (17816055)
Main Inventor
Wen-Ting LAN
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF (18482743)
Main Inventor
Jen-Yuan CHANG
PACKAGE STRUCTURE (18481975)
Main Inventor
Wei-Hung Lin
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18314536)
Main Inventor
Hui-Zhong ZHUANG
IMAGE SENSOR DEVICE (18487216)
Main Inventor
Yun-Wei CHENG
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING (17816257)
Main Inventor
Y.W. HUANG
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (17815854)
Main Inventor
Sheng-Tsung WANG
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17876465)
Main Inventor
Wu-Wei Tsai
SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES (18298629)
Main Inventor
Chung-Hao CAI
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17877970)
Main Inventor
Shahaji B. MORE
SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME (17875975)
Main Inventor
Chih-Ching WANG
GATE PROFILE TUNING FOR MULTIGATE DEVICE (18153700)
Main Inventor
Cheng-I Lin
DEVICE WITH TAPERED INSULATION STRUCTURE AND RELATED METHODS (17876737)
Main Inventor
Ya-Yi Tsai
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH THIN FILM TRANSISTOR (18477068)
Main Inventor
Marcus Johannes Henricus VAN DAL
Thin-Film Transistors For Detecting Miniature Targets (17876920)
Main Inventor
Wei Lee
FIELD EFFECT TRANSISTOR WITH ISOLATION STRUCTURE AND METHOD (18170482)
Main Inventor
Kuan-Ting PAN
SEMICONDUCTOR DETECTOR (18486114)
Main Inventor
Ya-Chin KING
MULTIPLE SUPPLY VOLTAGE TRACKS AND STANDARD CELLS (17873952)
Main Inventor
Hung-Chih Ou
CLOCK SYNTHESIZER (17815775)
Main Inventor
Wei Shuo LIN
Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes (18191787)
Main Inventor
Kao-Chih Liu
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17876044)
Main Inventor
Jhon Jhy LIAW
MEMORY STRUCTURE (17815285)
Main Inventor
Jhon-Jhy LIAW
FERROELECTRIC TUNNEL JUNCTION DEVICE (17815601)
Main Inventor
Kuen-Yi Chen
FERROELECTRIC MEMORY DEVICE WITH BLOCKING LAYER (18150289)
Main Inventor
Tzu-Yu Chen
MEMORY DEVICE AND SEMICONDUCTOR DIE, AND METHOD OF FABRICATING MEMORY DEVICE (18484466)
Main Inventor
Ji-Feng Ying
MEMORY DEVICE AND METHOD OF FORMING THE SAME (18152770)
Main Inventor
Cheng-Hsien Wu
Memory Device With Source Lines in Parallel (18447856)
Main Inventor
Ku-Feng Lin
MEMORY DEVICE AND FABRICATION METHOD THEREOF (17873166)
Main Inventor
Yu-Chao Lin
PHASE CHANGE RANDOM ACCESS MEMORY DEVICE (18231750)
Main Inventor
Chun-Hsu Yen
