17876558. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Kai-Fung Chang of Taipei City (TW)

Sheng-Feng Weng of Taichung City (TW)

Ming-Yu Yen of MiaoLi County (TW)

Kai-Ming Chiang of Taichung City (TW)

Wei-Jhan Tsai of Kaohsiung City (TW)

Chih-Wei Lin of Hsinchu County (TW)

Ching-Hua Hsieh of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17876558 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor package described in the patent application consists of a first redistribution circuit structure, a semiconductor die, and an electrically conductive structure. The semiconductor die is placed over and connected to the first redistribution circuit structure. The electrically conductive structure links the non-active side of the semiconductor die to a conductive feature of the first redistribution circuit structure. This allows for thermal coupling between the semiconductor die and the first redistribution circuit structure through the electrically conductive structure, which is composed of multiple layers with different materials.

• The semiconductor package includes a first redistribution circuit structure, a semiconductor die, and an electrically conductive structure.
• The semiconductor die is positioned over and electrically connected to the first redistribution circuit structure.
• The electrically conductive structure connects the non-active side of the semiconductor die to a conductive feature of the first redistribution circuit structure.
• The semiconductor die is thermally coupled to the first redistribution circuit structure through the electrically conductive structure.
• The electrically conductive structure is composed of multiple layers with different materials.

Potential Applications:

• This semiconductor package design can be used in various electronic devices that require efficient thermal management, such as smartphones, tablets, laptops, and other portable devices.
• It can also be applied in high-performance computing systems, servers, and data centers to enhance heat dissipation and improve overall performance.

Problems Solved:

• The electrically conductive structure provides a reliable and efficient thermal coupling between the semiconductor die and the first redistribution circuit structure, addressing the issue of heat dissipation in semiconductor packages.
• The multi-layer structure of the electrically conductive structure helps to optimize thermal conductivity and reduce thermal resistance, solving the problem of overheating and potential damage to the semiconductor die.

Benefits:

• Improved thermal management: The electrically conductive structure allows for effective heat transfer from the semiconductor die to the first redistribution circuit structure, preventing overheating and enhancing overall performance.
• Enhanced reliability: The reliable thermal coupling provided by the electrically conductive structure ensures the longevity and stability of the semiconductor package.
• Increased efficiency: The multi-layer structure of the electrically conductive structure optimizes thermal conductivity, leading to improved energy efficiency and reduced power consumption.

Original Abstract Submitted

A semiconductor package includes a first redistribution circuit structure, a semiconductor die, and an electrically conductive structure. The semiconductor die is disposed over and electrically coupled to the first redistribution circuit structure. The electrically conductive structure connects a non-active side of the semiconductor die to a conductive feature of the first redistribution circuit structure, where the semiconductor die is thermally couped to the first redistribution circuit structure through the electrically conductive structure, and the electrically conductive structure includes a structure of multi-layer with different materials.