17814836. FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Ting-Ting Kuo of Hsinchu (TW)

Li-Hsien Huang of Hsinchu (TW)

Tien-Chung Yang of Hsinchu (TW)

Yao-Chun Chuang of Hsinchu (TW)

Yinlung Lu of Hsinchu (TW)

Jun He of Hsinchu (TW)

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17814836 titled 'FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

Simplified Explanation

The semiconductor package structure described in the patent application includes a die with a frontside and a backside. It also includes a first redistribution layer (RDL) structure on the backside of the die and a second RDL structure on the frontside of the die. A through integrated fan-out via (TIV) is positioned laterally to the die and connects the first and second RDL structures. A molding compound is placed between the first and second RDL structures, and an enhancement layer is added on the second RDL structure. The enhancement layer has cascaded openings that are electrically connected to the first RDL structure. Pre-solder bumps are placed in these openings, and solder balls are connected to the second RDL structure.

  • The patent application describes a semiconductor package structure with a die, RDL structures, and a TIV for electrical connections.
  • The structure includes a molding compound and an enhancement layer with cascaded openings.
  • Pre-solder bumps are placed in the openings, and solder balls are connected to the second RDL structure.

Potential Applications

  • This semiconductor package structure can be used in various electronic devices that require efficient electrical connections.
  • It can be applied in mobile devices, computers, automotive electronics, and other electronic systems.

Problems Solved

  • The structure solves the problem of providing efficient electrical connections between different components of a semiconductor package.
  • It addresses the need for compact and reliable packaging solutions for electronic devices.

Benefits

  • The semiconductor package structure offers improved electrical connectivity and signal transmission.
  • It allows for a more compact and efficient design of electronic devices.
  • The structure enhances the reliability and performance of semiconductor packages.


Original Abstract Submitted

A semiconductor package structure is provided. The semiconductor package structure includes: a die having a frontside and a backside; a first redistribution layer (RDL) structure disposed on the backside of the die; a second RDL structure disposed on and electrically connected to the frontside of the die; a through integrated fan-out via (TIV) disposed lateral to the die and extending to electrically connect the first and the second RDL structures; a molding compound disposed between the first and second RDL structures; an enhancement layer disposed on the second RDL structure; a plurality of pre-solder bumps; and a plurality of solder balls disposed on and electrically connected to the second RDL structure. The enhancement layer includes a plurality of cascaded openings electrically connected to the first RDL structure. Each of the pre-solder bumps is disposed in one of the cascaded openings.

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