17874192. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wensen Hung of Hsinchu County (TW)

Jia-Syuan Li of Taoyuan City (TW)

Tsung-Yu Chen of Hsinchu City (TW)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17874192 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The abstract describes a package structure that includes a substrate, a semiconductor package, a first lid structure, and a second lid structure. The first lid structure has an opening exposing a region of the semiconductor package. A thermal interface material is placed between the second lid structure and the semiconductor package, while a phase change adhesive is placed between the second lid structure and the first lid structure.

• The package structure includes a substrate, semiconductor package, and lid structures.
• The first lid structure has an opening to expose a region of the semiconductor package.
• A thermal interface material is used between the second lid structure and the semiconductor package.
• A phase change adhesive is used between the second lid structure and the first lid structure.

Potential applications of this technology:

• Electronic packaging and assembly
• Semiconductor devices
• Thermal management systems

Problems solved by this technology:

• Improved thermal management and heat dissipation in semiconductor packages
• Enhanced protection and sealing of the semiconductor package

Benefits of this technology:

• Efficient heat transfer and cooling of the semiconductor package
• Enhanced reliability and longevity of semiconductor devices
• Improved performance and functionality of electronic systems

Original Abstract Submitted

A package structure includes a substrate, a semiconductor package disposed over the substrate, a first lid structure disposed over the substrate, and a second lid structure disposed over the semiconductor package and the first lid structure. The first lid structure includes an opening exposing a region of the semiconductor package. A thermal interface material is disposed between the second lid structure and the semiconductor package, and a phase change adhesive is disposed between the second lid structure and the first lid structure.