17815088. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
Semiconductor Package and Method
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Jeng-Nan Hung of Taichung City (TW)
Chih-Hang Tung of Hsinchu (TW)
Semiconductor Package and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 17815088 titled 'Semiconductor Package and Method
Simplified Explanation
The method described in the patent application involves several steps:
1. Directly bonding a first wafer to a second wafer, where the bonding creates an electrical connection between a first interconnect structure of the first wafer and a second interconnect structure of the second wafer. 2. Directly bonding first semiconductor devices to the second wafer, where the bonding creates an electrical connection between the first semiconductor devices and the second interconnect structure. 3. Encapsulating the first semiconductor devices with a first encapsulant. 4. Forming solder bumps over the first semiconductor devices.
Potential applications of this technology:
- Integrated circuit manufacturing: This method can be used in the production of integrated circuits, where it enables the direct bonding of wafers and semiconductor devices, improving the overall performance and reliability of the circuits.
- Microelectronics packaging: The direct bonding and encapsulation steps can be applied in the packaging of microelectronic components, providing enhanced electrical connections and protection for the devices.
- Sensor fabrication: This method can be utilized in the production of sensors, allowing for the direct bonding of sensor elements and interconnect structures, resulting in more efficient and reliable sensor devices.
Problems solved by this technology:
- Improved electrical connections: The direct bonding technique ensures a strong and reliable electrical connection between the wafers, semiconductor devices, and interconnect structures, reducing the risk of signal loss or failure.
- Enhanced device reliability: The encapsulation of the semiconductor devices with an encapsulant provides protection against environmental factors, such as moisture or contaminants, increasing the overall reliability and lifespan of the devices.
Benefits of this technology:
- Higher performance: The direct bonding method enables shorter interconnect paths, reducing resistance and improving signal transmission speed, leading to enhanced overall performance of the electronic devices.
- Miniaturization: The direct bonding and encapsulation steps allow for the fabrication of compact and miniaturized devices, enabling advancements in areas such as wearable technology or Internet of Things (IoT) devices.
- Cost-effective manufacturing: The method simplifies the manufacturing process by eliminating the need for additional bonding materials or complex assembly steps, potentially reducing production costs.
Original Abstract Submitted
A method includes directly bonding a first wafer to a second wafer, wherein the bonding electrically connects a first interconnect structure of the first wafer to a second interconnect structure of the second wafer; directly bonding first semiconductor devices to the second wafer, wherein the bonding electrically connects the first semiconductor devices to the second interconnect structure; encapsulating the first semiconductor devices with a first encapsulant; and forming solder bumps over the first semiconductor devices.
