17876920. Thin-Film Transistors For Detecting Miniature Targets simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
Thin-Film Transistors For Detecting Miniature Targets
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chung-Liang Cheng of Changhua County (TW)
Pei-Wen Liu of Hsinchu City (TW)
Ke-Wei Su of Hsinchu County (TW)
Kuan-Lun Cheng of Hsin-Chu (TW)
Thin-Film Transistors For Detecting Miniature Targets - A simplified explanation of the abstract
This abstract first appeared for US patent application 17876920 titled 'Thin-Film Transistors For Detecting Miniature Targets
Simplified Explanation
The abstract describes a patent application for an interconnect structure that is placed over a semiconductor substrate. The structure consists of multiple interconnect layers and includes two thin-film transistors (TFTs) that extend vertically through some of the interconnect layers. An opening is created between the two TFTs within the interconnect structure, and a sensing film is placed on the bottom and side surfaces of the opening.
- The interconnect structure is placed over a semiconductor substrate.
- It includes multiple interconnect layers.
- Two thin-film transistors (TFTs) are vertically extended through some of the interconnect layers.
- An opening is formed between the two TFTs within the interconnect structure.
- A sensing film is applied to the bottom and side surfaces of the opening.
Potential Applications:
- This technology can be used in the manufacturing of electronic devices such as integrated circuits and microprocessors.
- It can improve the performance and functionality of these devices by providing a more efficient interconnect structure.
Problems Solved:
- The interconnect structure solves the problem of efficiently connecting different components within a semiconductor substrate.
- It allows for the vertical extension of thin-film transistors, enabling better integration and connectivity.
Benefits:
- The interconnect structure improves the overall performance and functionality of electronic devices.
- It enhances the efficiency of interconnectivity between components within a semiconductor substrate.
- The use of thin-film transistors and sensing films provides more accurate and reliable sensing capabilities.
Original Abstract Submitted
An interconnect structure is disposed over a semiconductor substrate. The interconnect structure includes a plurality of interconnect layers. A first thin-film transistor (TFT) and a second TFT disposed over the semiconductor substrate. The first TFT and the second TFT each vertically extend through at least a subset of the interconnect layers. An opening is formed in the interconnect structure. The opening is disposed between the first TFT and the second TFT. A sensing film is disposed over a bottom surface and side surfaces of the opening.
