17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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Integrated Circuit Packages and Methods of Forming the Same

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Ping-Yin Hsieh of Hsinchu (TW)

Chih-Hao Chen of Taipei City (TW)

Yi-Huan Liao of Hsinchu (TW)

Pu Wang of Hsinchu (TW)

Li-Hui Cheng of New Taipei City (TW)

Integrated Circuit Packages and Methods of Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 17815629 titled 'Integrated Circuit Packages and Methods of Forming the Same

Simplified Explanation

The abstract of this patent application describes a device that includes a package component with an integrated circuit die and conductive connectors on the front side. The device also has a back-side metal layer, an indium thermal interface material, and a lid on the back side of the package component. The lid is adhered to a package substrate connected to the conductive connectors.

  • The device includes an integrated circuit die and conductive connectors.
  • The conductive connectors are located on the front side of the package component.
  • A back-side metal layer is present on the back side of the package component.
  • An indium thermal interface material is applied on the back side of the back-side metal layer.
  • A lid is placed on the back side of the indium thermal interface material.
  • The lid is adhered to the package substrate connected to the conductive connectors.

Potential Applications:

  • This technology can be applied in electronic devices that require efficient thermal management, such as high-performance computers, servers, or mobile devices.
  • It can be used in devices that generate a significant amount of heat, ensuring proper cooling and preventing overheating.

Problems Solved:

  • The integration of the indium thermal interface material and the lid helps improve the thermal conductivity and heat dissipation of the device.
  • The conductive connectors and package substrate provide a reliable electrical connection between the integrated circuit die and external components.

Benefits:

  • Enhanced thermal management capabilities ensure the device operates within optimal temperature ranges, improving performance and reliability.
  • The improved electrical connection between the integrated circuit die and external components enhances the overall functionality and efficiency of the device.


Original Abstract Submitted

In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

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