17878647. Semiconductor Device Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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Semiconductor Device Packages and Methods of Forming the Same

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chi-Yang Yu of Zhongli City (TW)

Chin-Liang Chen of Kaohsiung City (TW)

Hao-Cheng Hou of Hsinchu (TW)

Jung Wei Cheng of Hsinchu (TW)

Yu-Min Liang of Zhongli City (TW)

Tsung-Ding Wang of Tainan (TW)

Semiconductor Device Packages and Methods of Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 17878647 titled 'Semiconductor Device Packages and Methods of Forming the Same

Simplified Explanation

The patent application discusses semiconductor device packages and methods of forming them. It describes a device that includes a redistribution structure, a buffer feature, a reflowable connector, an interposer, and an encapsulant.

  • The device includes a redistribution structure, which consists of an upper dielectric layer and an under-bump metallization.
  • A buffer feature is present on the under-bump metallization and the upper dielectric layer. It covers the edge of the under-bump metallization and is bonded to the upper dielectric layer.
  • A reflowable connector extends through the buffer feature and is coupled to the under-bump metallization.
  • An interposer is coupled to the reflowable connector.
  • The device is encapsulated with an encapsulant, which is different from the buffer feature.

Potential applications of this technology:

  • This technology can be used in the manufacturing of semiconductor devices and integrated circuits.
  • It can be applied in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.

Problems solved by this technology:

  • The buffer feature helps protect the under-bump metallization and the upper dielectric layer from damage during the packaging process.
  • The reflowable connector provides a reliable electrical connection between the under-bump metallization and the interposer.

Benefits of this technology:

  • The buffer feature improves the reliability and durability of the semiconductor device package.
  • The reflowable connector allows for easier assembly and disassembly of the device.
  • The encapsulant provides protection and insulation for the interposer and reflowable connector.


Original Abstract Submitted

Semiconductor device packages and methods of forming the same are discussed. In an embodiment, a device includes: a redistribution structure comprising an upper dielectric layer and an under-bump metallization; a buffer feature on the under-bump metallization and the upper dielectric layer, the buffer feature covering an edge of the under-bump metallization, the buffer feature bonded to the upper dielectric layer; a reflowable connector extending through the buffer feature, the reflowable connector coupled to the under-bump metallization; an interposer coupled to the reflowable connector; and an encapsulant around the interposer and the reflowable connector, the encapsulant different from the buffer feature.

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