17873170. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Cheng-Chieh Li of Hsinchu City (TW)
Chih-Wei Wu of Yilan County (TW)
Ying-Ching Shih of Hsinchu City (TW)
Wen-Chih Chiou of Miaoli County (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17873170 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes an interposer substrate, multiple semiconductor dies, a first encapsulant, at least one heat dissipation element, and a second encapsulant. The semiconductor dies are placed on the interposer substrate, and the first encapsulant surrounds them. The heat dissipation element is positioned on top of the semiconductor dies, and the second encapsulant surrounds it.
- The interposer substrate provides a platform for mounting the semiconductor dies and facilitates electrical connections.
- The first encapsulant protects and isolates the semiconductor dies from external factors.
- The heat dissipation element helps dissipate heat generated by the semiconductor dies.
- The second encapsulant further enhances the protection and isolation of the heat dissipation element.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices, such as smartphones, tablets, and computers.
- It can be employed in automotive electronics, aerospace systems, and industrial equipment.
Problems solved by this technology:
- The interposer substrate and encapsulants provide physical protection to the delicate semiconductor dies, preventing damage from external factors.
- The heat dissipation element helps manage and dissipate the heat generated by the semiconductor dies, preventing overheating and potential performance issues.
Benefits of this technology:
- Improved reliability and durability of the semiconductor package due to the protective encapsulants and interposer substrate.
- Enhanced thermal management, ensuring optimal performance and preventing overheating.
- Enables the integration of multiple semiconductor dies in a compact package, saving space and enabling higher functionality.
Original Abstract Submitted
Disclosed are a semiconductor package and a manufacturing method of a semiconductor package. In one embodiment, the semiconductor package includes an interposer substrate, a plurality of semiconductor dies, a first encapsulant, at least one heat dissipation element and a second encapsulant. The plurality of semiconductor dies are disposed on the interposer substrate. The first encapsulant is disposed on the interposer substrate and surrounds the plurality of semiconductor dies. The at least one heat dissipation element is disposed on the plurality of semiconductor dies. The second encapsulant is disposed on the first encapsulant and surrounds the at least one heat dissipation element.
