Pages that link to "Category:Intel Corporation"
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The following pages link to Category:Intel Corporation:
View (previous 100 | next 100) (20 | 50 | 100 | 250 | 500)- Patent Applications Report for 24th Nov 2023 (← links)
- Patent Applications Report for 10th Nov 2023 (← links)
- Patent Applications Report for 17th Nov 2023 (← links)
- Patent Applications Report for 27th Oct 2023 (← links)
- Patent Applications Report for 6th Oct 2023 (← links)
- US Patent Application 17825558. SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD simplified abstract (← links)
- US Patent Application 18449651. SYSTEMS AND METHODS FOR COMPUTING DOT PRODUCTS OF NIBBLES IN TWO TILE OPERANDS simplified abstract (← links)
- US Patent Application 18361128. BOOT PROCESS FOR EARLY DISPLAY INITIALIZATION AND VISUALIZATION simplified abstract (← links)
- US Patent Application 18326467. SYSTEMS AND METHODS FOR IMPLEMENTING AN INTELLIGENT APPLICATION PROGRAM INTERFACE FOR AN INTELLIGENT OPTIMIZATION PLATFORM simplified abstract (← links)
- US Patent Application 18302999. POWER ERROR MONITORING AND REPORTING WITHIN A SYSTEM ON CHIP FOR FUNCTIONAL SAFETY simplified abstract (← links)
- US Patent Application 18232765. ACCELERATED MEMORY TRAINING THROUGH IN-BAND CONFIGURATION REGISTER UPDATE MODE simplified abstract (← links)
- US Patent Application 17826933. USB TYPE-C SUBSYSTEM simplified abstract (← links)
- US Patent Application 18250325. MULTI-PORT MEMORY LINK EXPANDER TO SHARE DATA AMONG HOSTS simplified abstract (← links)
- US Patent Application 18326772. AI-BASED COMPONENT PLACEMENT TECHNOLOGY FOR PCB CIRCUITS simplified abstract (← links)
- US Patent Application 18323843. MISUSE INDEX FOR EXPLAINABLE ARTIFICIAL INTELLIGENCE IN COMPUTING ENVIRONMENTS simplified abstract (← links)
- US Patent Application 18325348. NEURAL NETWORK TRAINING AND INFERENCE WITH HIERARCHICAL ADJACENCY MATRIX simplified abstract (← links)
- US Patent Application 18231917. APPARATUS AND METHOD FOR SCALABLE QUBIT ADDRESSING simplified abstract (← links)
- US Patent Application 17824372. LOSSY COMPRESSION TECHNOLOGY FOR SMALL IMAGE TILES simplified abstract (← links)
- US Patent Application 18031564. INCREMENTAL 2D-TO-3D POSE LIFTING FOR FAST AND ACCURATE HUMAN POSE ESTIMATION simplified abstract (← links)
- US Patent Application 18305175. METHOD AND APPARATUS FOR ENCODING BASED ON IMPORTANCE VALUES simplified abstract (← links)
- US Patent Application 18305511. FRAGMENT COMPRESSION FOR COARSE PIXEL SHADING simplified abstract (← links)
- US Patent Application 18322665. GLARE AND OCCLUDED VIEW COMPENSATION FOR AUTOMOTIVE AND OTHER APPLICATIONS simplified abstract (← links)
- US Patent Application 18213231. REFRESH COMMAND CONTROL FOR HOST ASSIST OF ROW HAMMER MITIGATION simplified abstract (← links)
- US Patent Application 17752941. VIA STRUCTURE FOR EMBEDDED COMPONENT AND METHOD FOR MAKING SAME simplified abstract (← links)
- US Patent Application 17825340. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN simplified abstract (← links)
- US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract (← links)
- US Patent Application 18232670. WRAP-AROUND TRENCH CONTACT STRUCTURE AND METHODS OF FABRICATION simplified abstract (← links)
- US Patent Application 18227233. THIN FILM TRANSISTORS HAVING DOUBLE GATES simplified abstract (← links)
- US Patent Application 18228139. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NANOWIRES WITH TIGHT VERTICAL SPACING simplified abstract (← links)
- US Patent Application 18049651. ANTENNA SWITCHING FOR IMPROVED IN-DEVICE CO-EXISTENCE PERFORMANCE simplified abstract (← links)
- US Patent Application 18199697. HYBRID PHY WITH INTERLEAVED AND NON-INTERLEAVED RS-FEC AND FEC MODE DETERMINATION DURING ADAPTIVE LINK TRAINING PROTOCOL simplified abstract (← links)
- US Patent Application 18190906. ADAPTATION OF SECURE SOUNDING SIGNAL TO BANDWIDTH VARIATION simplified abstract (← links)
- US Patent Application 18323812. SOFTWARE-BASED PHYSICAL LAYER CONFIGURATION simplified abstract (← links)
- US Patent Application 18230588. IN-NETWORK COMPUTE OPERATIONS UTILIZING ENCRYPTED COMMUNICATIONS simplified abstract (← links)
- US Patent Application 18231726. ENCODING OF AN IMPLICIT PACKET SEQUENCE NUMBER IN A PACKET simplified abstract (← links)
- US Patent Application 18189789. USER INTERFACES FOR ELECTRONIC DEVICES simplified abstract (← links)
- US Patent Application 18352810. MOBILITY FEATURES FOR NEXT GENERATION CELLULAR NETWORKS simplified abstract (← links)
- Patent Applications Report for 8th Dec 2023 (← links)
- Patent Applications Report for 15th Dec 2023 (← links)
- Patent Applications Report for 29th Dec 2023 (← links)
- Patent Applications Report for 22nd Dec 2023 (← links)
- 17851968. LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME simplified abstract (Intel Corporation) (← links)
- 18242869. ROAD SURFACE FRICTION BASED PREDICTIVE DRIVING FOR COMPUTER ASSISTED OR AUTONOMOUS DRIVING VEHICLES simplified abstract (Intel Corporation) (← links)
- 17849557. TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR simplified abstract (Intel Corporation) (← links)
- 18036823. AUTOMATICALLY OPEN LAPTOP HINGE simplified abstract (Intel Corporation) (← links)
- 18339827. PROCESSOR POWER MANAGEMENT simplified abstract (Intel Corporation) (← links)
- 18244748. DEVICE, METHOD AND SYSTEM FOR TRANSPARENTLY CHANGING A FREQUENCY OF AN INTERCONNECT FABRIC simplified abstract (Intel Corporation) (← links)
- 17850090. PERFORMING DISTRIBUTED PROCESSING USING DISTRIBUTED MEMORY simplified abstract (Intel Corporation) (← links)
- 18456699. SYSTEMS, APPARATUSES, AND METHODS FOR ADDITION OF PARTIAL PRODUCTS simplified abstract (Intel Corporation) (← links)
- 17850044. RECONFIGURABLE VECTOR PROCESSING IN A MEMORY simplified abstract (Intel Corporation) (← links)
- 17848142. IMPLICIT MEMORY CORRUPTION DETECTION FOR CONDITIONAL DATA TYPES simplified abstract (Intel Corporation) (← links)
- 17848284. AUTOMATIC FUSION OF ARITHMETIC IN-FLIGHT INSTRUCTIONS simplified abstract (Intel Corporation) (← links)
- 18463142. METHODS AND APPARATUS TO INSERT PROFILING INSTRUCTIONS INTO A GRAPHICS PROCESSING UNIT KERNEL simplified abstract (Intel Corporation) (← links)
- 18339454. DATA LOCALITY ENHANCEMENT FOR GRAPHICS PROCESSING UNITS simplified abstract (Intel Corporation) (← links)
- 18241062. METHODS AND APPARATUS TO PERFORM CLOUD-BASED ARTIFICIAL INTELLIGENCE OVERCLOCKING simplified abstract (Intel Corporation) (← links)
- 18207870. SYSTEMS, METHODS, AND APPARATUSES FOR HETEROGENEOUS COMPUTING simplified abstract (Intel Corporation) (← links)
- 18219557. TECHNOLOGIES FOR PROVIDING EFFICIENT POOLING FOR A HYPER CONVERGED INFRASTRUCTURE simplified abstract (Intel Corporation) (← links)
- 17852189. HIERARCHICAL CORE VALID TRACKER FOR CACHE COHERENCY simplified abstract (Intel Corporation) (← links)
- 17846688. SELECTIVE PROVISIONING OF SUPPLEMENTARY MICRO-OPERATION CACHE RESOURCES simplified abstract (Intel Corporation) (← links)
- 18321490. UNIFIED ADDRESS TRANSLATION FOR VIRTUALIZATION OF INPUT/OUTPUT DEVICES simplified abstract (Intel Corporation) (← links)
- 18035705. DEVICE, SYSTEM, AND METHOD FOR INSPECTING DIRECT MEMORY ACCESS REQUESTS simplified abstract (Intel Corporation) (← links)
- 17851739. MULTICORE SYNCHRONIZATION MECHANISM FOR TIME CRITICAL RADIO SYSTEMS simplified abstract (Intel Corporation) (← links)
- 17849351. CONTROL FLOW INTEGRITY TO PREVENT POTENTIAL LEAKAGE OF SENSITIVE DATA TO ADVERSARIES simplified abstract (Intel Corporation) (← links)
- 18322988. EFFICIENT CONVOLUTION IN MACHINE LEARNING ENVIRONMENTS simplified abstract (Intel Corporation) (← links)
- 18030025. METHOD AND SYSTEM OF IMAGE PROCESSING WITH INCREASED SUBJECTIVE QUALITY 3D RECONSTRUCTION simplified abstract (Intel Corporation) (← links)
- 18457169. METHODS AND APPARATUS FOR ASSISTED DATA REVIEW FOR ACTIVE LEARNING CYCLES simplified abstract (Intel Corporation) (← links)
- 17847625. SPUTTER TARGETS AND SOURCES FOR SELF-DOPED SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation) (← links)
- 17851999. MULTI-PATHWAY ROUTING VIA THROUGH HOLE simplified abstract (Intel Corporation) (← links)
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation) (← links)
- 18034133. TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES simplified abstract (Intel Corporation) (← links)
- 17848607. ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE simplified abstract (Intel Corporation) (← links)
- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation) (← links)
- 17846303. SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation) (← links)
- 17847282. PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation) (← links)
- 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) (← links)
- 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation) (← links)
- 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation) (← links)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation) (← links)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation) (← links)
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation) (← links)
- 17850779. INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDARY VIA simplified abstract (Intel Corporation) (← links)
- 17852028. SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS simplified abstract (Intel Corporation) (← links)
- 18314875. INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTING TRACKS simplified abstract (Intel Corporation) (← links)
- 17849207. MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF simplified abstract (Intel Corporation) (← links)
- 17851985. INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY simplified abstract (Intel Corporation) (← links)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation) (← links)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation) (← links)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation) (← links)
- 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation) (← links)
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation) (← links)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation) (← links)
- 17847111. TECHNOLOGIES FOR OVERLAY METROLOGY MARKS simplified abstract (Intel Corporation) (← links)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation) (← links)
- 17847652. STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation) (← links)
- 18253954. DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM simplified abstract (Intel Corporation) (← links)
- 18244689. PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES simplified abstract (Intel Corporation) (← links)
- 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation) (← links)