17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
Organization Name
Inventor(s)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Darko Grujicic of Chandler AZ (US)
Marcel Wall of Phoenix AZ (US)
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17848615 titled 'ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
Simplified Explanation
The patent application relates to a method of reducing delamination between a dielectric material and a copper trace by applying an organic adhesion promoter layer on the surface of the copper trace. This promotes a smooth surface interface between the copper trace and a copper feature, such as a copper-filled via, which improves signal transmission and allows for higher frequency routing on a package. The method does not require roughing of the copper trace for adhesion to the dielectric material.
- Method of reducing delamination between a dielectric material and a copper trace
- Application of an organic adhesion promoter layer on the surface of the copper trace
- Facilitates a smooth surface interface between the copper trace and a copper feature
- Improves signal transmission and enables routing of higher frequency signals on a package
- Does not require roughing of the copper trace for adhesion to the dielectric material
Potential Applications
- Electronics manufacturing
- Printed circuit board (PCB) production
- Semiconductor packaging
Problems Solved
- Delamination between dielectric material and copper trace
- Poor signal transmission and insertion loss
- Difficulty in routing higher frequency signals on a package
Benefits
- Reduced delamination and improved adhesion
- Enhanced signal transmission and reduced insertion loss
- Enables routing of higher frequency signals
- Simplifies manufacturing process by eliminating the need for roughing of copper trace
Original Abstract Submitted
Embodiments herein relate to systems, apparatuses, or processes directed to an organic adhesion promoter layer on the surface of a copper trace to reduce delamination between a dielectric material and the surface of the copper trace, and to facilitate a smooth surface interface between the surface of the copper trace and of a copper feature, such as a copper-filled via, placed on the surface of the copper trace. The smooth surface interface reduces insertion loss and enables routing of higher frequency signals on a package, and does not require roughing of the copper trace in order to adhere to the dielectric material. Other embodiments may be described and/or claimed.
