17848607. ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE simplified abstract (Intel Corporation)
Contents
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
Organization Name
Inventor(s)
Kavitha Nagarajan of Bangalore (IN)
Eng Huat Goh of Ayer Itam (MY)
Telesphor Kamgaing of Chandler AZ (US)
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17848607 titled 'ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
Simplified Explanation
The patent application describes a system for creating packages that include memory modules with electrically conductive strips on the side. These strips are used to route power or provide a ground to multiple BGA contacts on the memory module.
- Memory modules have electrically conductive strips on the side
- Strips are used to route power or provide a ground to multiple BGA contacts on the memory module
- This eliminates the need for additional layers in the substrate to route power, reducing the package's Z-height
- The invention enables the creation of packages with fewer layers and a reduced overall size
Potential applications of this technology:
- Memory modules for electronic devices such as computers, smartphones, and tablets
- Data centers and server farms that require high-performance memory modules
- Industrial applications that require compact and efficient memory solutions
Problems solved by this technology:
- Reduces the need for additional layers in the substrate, simplifying the manufacturing process
- Reduces the Z-height of the package, allowing for more compact and slim designs
- Improves the efficiency and performance of memory modules by providing a direct power and ground connection
Benefits of this technology:
- Simplifies the manufacturing process by eliminating the need for additional layers in the substrate
- Enables the creation of more compact and slim memory modules
- Improves the overall efficiency and performance of memory modules by providing a direct power and ground connection
Original Abstract Submitted
Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and/or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and/or claimed.
