18034133. TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES simplified abstract (Intel Corporation)

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

Organization Name

Intel Corporation

Inventor(s)

Prabhakar Subrahmanyam of San Jose CA (US)

Tong Wa Chao of San Jose CA (US)

Ying-Feng Pang of San Jose CA (US)

Yi Xia of Campbell CA (US)

Rahima K. Mohammed of San Jose CA (US)

Victor P. Polyanko of San Jose CA (US)

Ridvan A. Sahan of Sunnyvale CA (US)

Guangying Zhang of Shanghai (CN)

Guoliang Ying of Shanghai (CN)

Chuanlou Wang of Shanghai (CN)

Jun Lu of Shanghai (CN)

Liguang Du of Shanghai (CN)

Peng Wei of Shangha (CN)

Xiang Que of Shanghai (CN)

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18034133 titled 'TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

Abstract

The patent application describes techniques for heat sinks and cold plates for compute systems. One embodiment involves a heat sink with two sub-heat sinks that are mechanically connected but thermally isolated, allowing them to independently cool different dies on the same integrated circuit component. Another embodiment involves a system with an integrated circuit component cooled by two water blocks, where the first water block forms a loop with a gap and the second water block has a pedestal that extends through the gap to contact the integrated circuit component. The first and second water blocks can independently cool different dies on the same integrated circuit component.

Bullet Points

• Heat sink with two sub-heat sinks that are mechanically connected but thermally isolated
• Sub-heat sinks can independently cool different dies on the same integrated circuit component
• System with an integrated circuit component cooled by two water blocks
• First water block forms a loop with a gap
• Second water block has a pedestal that extends through the gap to contact the integrated circuit component
• First and second water blocks can independently cool different dies on the same integrated circuit component

Potential Applications

• High-performance computing systems
• Data centers
• Gaming consoles
• Servers
• Supercomputers

Problems Solved

• Efficient cooling of integrated circuit components
• Independent cooling of different dies on the same integrated circuit component
• Thermal management in high-performance computing systems

Benefits

• Improved heat dissipation and cooling efficiency
• Enhanced performance and reliability of compute systems
• Ability to cool different dies independently
• Optimal thermal management for integrated circuit components

Original Abstract Submitted

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.