17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)

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ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE

Organization Name

Intel Corporation

Inventor(s)

Telesphor Kamgaing of Chandler AZ (US)

Chee Kheong Yoon of Bayan Lepas (MY)

Chu Aun Lim of Hillsboro OR (US)

Eng Huat Goh of Ayer Itam (MY)

Min Suet Lim of Gelugor (MY)

Kavitha Nagarajan of Bangalore (IN)

Jooi Wah Wong of Bukit Mertajam (MY)

ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17848643 titled 'ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE

Simplified Explanation

The patent application is about a system that involves an electrical conductor or power corridor on the outside of a package substrate. The conductor is raised or extends from the surface of the substrate. This system aims to reduce the number of layers required within the substrate by removing power planes and using the electrical conductors on the surface of the package instead.

  • The patent application is related to systems, apparatuses, techniques, or processes for an electrical conductor on the outside of a package substrate.
  • The electrical conductor is raised or extends from the surface of the substrate.
  • The purpose of this system is to reduce the number of layers needed within the substrate.
  • Power planes within the substrate are removed and replaced by the electrical conductors on the surface of the package.
  • This innovation can potentially simplify the design and manufacturing process of electronic packages.
  • It may also lead to cost savings by reducing the complexity and number of layers in the substrate.
  • The technology could be applied in various industries that use electronic packages, such as consumer electronics, automotive, aerospace, and telecommunications.
  • The system solves the problem of having a high number of layers within a package substrate.
  • By removing power planes and using surface-mounted electrical conductors, the need for multiple layers is reduced.
  • This technology provides a more efficient and streamlined approach to designing and manufacturing electronic packages.
  • The benefits of this technology include simplified design, cost savings, and potentially improved performance of electronic packages.
  • By reducing the number of layers, the overall size and weight of the package may also be reduced.
  • The use of surface-mounted electrical conductors can enhance the thermal management of the package.


Original Abstract Submitted

Embodiments herein relate to systems, apparatuses, techniques, or processes directed to an electrical conductor, or power corridor, on the outside of a package substrate, wherein the electrical conductor is raised, or extends from a surface of the package substrate. In embodiments, this electrical conductor may be used to reduce the number of layers required within the package substrate by removing power planes within the substrate to the electrical conductors on the surface of the package. Other embodiments may be described and/or claimed.

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