US Patent Application 17825558. SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD simplified abstract
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Contents
SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD
Organization Name
Inventor(s)
Siva Prasad Jangili Ganga of Telangana (IN)
Shailendra Singh Chauhan of Bengaluru (IN)
Abhijith Prabha of Piravom (IN)
Geejagaaru Krishnamurthy Sandesh of Bangalore (IN)
SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17825558 titled 'SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD
Simplified Explanation
The patent application describes an electronic system with a printed circuit board and a substrate.
- The substrate has two sides, a top and bottom.
- At least one memory unit is connected to the bottom side of the substrate.
- At least one processor is connected to the top side of the substrate.
- The memory is connected to the processor using interconnects that pass through the substrate.
Original Abstract Submitted
An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.
