17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER

Organization Name

Intel Corporation

Inventor(s)

Cemil S. Geyik of Gilbert AZ (US)

Kristof Kuwawi Darmawikarta of Chandler AZ (US)

Zhiguo Qian of Chandler AZ (US)

Kemal Aygun of Tempe AZ (US)

Jung Kyu Han of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Rengarajan Shanmugam of Chandler AZ (US)

Robert L. Sankman of Phoenix AZ (US)

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17851957 titled 'INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER

Simplified Explanation

The abstract describes a patent application for silver-coated conductive structures in integrated circuit (IC) package supports. The invention involves the use of a conductive line with a silver-coated first material layer and a second material layer containing silicon or aluminum, along with nitrogen and oxygen.

• Silver-coated conductive structures are disclosed for use in IC package supports.
• The conductive line in the support is coated with a first material layer containing silver.
• The first material layer covers the top surface and side surfaces of the conductive line.
• A second material layer, containing silicon or aluminum and nitrogen and oxygen, is applied on top of the first material layer.

Potential applications of this technology:

• Integrated circuit (IC) package supports in electronic devices.
• Semiconductor manufacturing and packaging industries.
• Circuit boards and electronic components.

Problems solved by this technology:

• Improved conductivity and electrical performance in IC package supports.
• Enhanced durability and reliability of integrated circuits.
• Reduction in signal loss and interference.

Benefits of this technology:

• Increased efficiency and performance of electronic devices.
• Enhanced signal transmission and reduced noise.
• Improved overall reliability and lifespan of integrated circuits.

Original Abstract Submitted

Disclosed herein are silver-coated conductive structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line, a first material layer on a top surface and on side surfaces of the conductive line, the first material layer including silver, and a second material layer on the first material layer, the second material layer including silicon or aluminum, and one or more of nitrogen and oxygen.