17851999. MULTI-PATHWAY ROUTING VIA THROUGH HOLE simplified abstract (Intel Corporation)
Contents
MULTI-PATHWAY ROUTING VIA THROUGH HOLE
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Cemil Serdar Geyik of Gilbert AZ (US)
Jason Steill of Phoenix AZ (US)
MULTI-PATHWAY ROUTING VIA THROUGH HOLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17851999 titled 'MULTI-PATHWAY ROUTING VIA THROUGH HOLE
Simplified Explanation
The abstract describes an electronic device with a substrate layer and a through hole passing through it. The device also includes two electrical pathways passing through the through hole and an insulation layer that isolates the pathways from each other.
- The electronic device has a substrate layer with a through hole passing through it.
- There are two electrical pathways that pass through the through hole, connecting positions on the first and second sides of the substrate layer.
- An insulation layer is present within the through hole, separating and isolating the two electrical pathways.
Potential Applications
- This technology can be used in electronic devices that require electrical connections between different sides of a substrate layer.
- It can be applied in circuit boards, sensors, and other electronic components where electrical pathways need to pass through a substrate.
Problems Solved
- The device solves the problem of creating electrical connections between different sides of a substrate layer without causing interference or short circuits.
- It addresses the challenge of maintaining electrical isolation between pathways passing through the same through hole.
Benefits
- The insulation layer ensures that the electrical pathways are electrically isolated, preventing interference and short circuits.
- The through hole design allows for efficient and compact electrical connections within the device.
- The technology provides a reliable and effective solution for creating electrical pathways through a substrate layer.
Original Abstract Submitted
An electronic device comprises a substrate layer comprising a first side and an opposing second side, a through hole passing through the substrate layer between the first side and the second side, a first electrical pathway passing from a first position on the first side of the substrate layer, through a first portion of the through hole, to a first corresponding position on the second side of the substrate layer, a second electrical pathway passing from a second position on the first side of the substrate layer, through a second portion of the through hole, to a corresponding second position on the second side of the substrate layer, and an insulation layer between the first electrical pathway and the second electrical pathway within the through hole, wherein the insulation layer electrically isolates the first electrical pathway from the second electrical pathway.
