17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)

PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES

Organization Name

Intel Corporation

Inventor(s)

Sameer Paital of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Kristof Kuwawi Darmawikarta of Chandler AZ (US)

Tchefor Ndukum of Chandler AZ (US)

Vejayakumaran Padavettan of Kulim (MY)

Pooja Wadhwa of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17847407 titled 'PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES

Simplified Explanation

The patent application describes a microelectronic assembly that includes an interposer, integrated circuit (IC) dies, and a bridge die. The interposer is made of a dielectric material and has a pad of conductive material with a ceramic liner and fin structures. The IC dies are connected to the interposer, and the bridge die is conductively coupled to the IC dies. The bridge die has a first face near the IC dies and a second face in contact with the pad.

• The microelectronic assembly includes an interposer made of a dielectric material.
• The interposer has a pad of conductive material with a ceramic liner and fin structures.
• At least two IC dies are connected to the interposer.
• A bridge die is conductively coupled to the IC dies.
• The bridge die has a first face near the IC dies and a second face in contact with the pad.

Potential Applications

• Microelectronic devices and systems
• Semiconductor industry
• Electronics manufacturing

Problems Solved

• Improved electrical connectivity between IC dies and the interposer
• Enhanced thermal management through the use of ceramic liner and fin structures
• Increased reliability and performance of microelectronic assemblies

Benefits

• Higher efficiency and functionality of microelectronic devices
• Improved heat dissipation and thermal stability
• Enhanced electrical performance and signal integrity

Original Abstract Submitted

Embodiments of a microelectronic assembly comprise an interposer comprising a dielectric material and a pad of conductive material having at least one of a ceramic liner and fin structures; at least two integrated circuit (IC) dies coupled to the interposer; and a bridge die in the interposer conductively coupled to the at least two IC dies. The bridge die has a first face and an opposing second face, the first face of the bridge die is proximate to the at least two IC dies, and the second face of the bridge die is in contact with the pad.