US Patent Application 18326772. AI-BASED COMPONENT PLACEMENT TECHNOLOGY FOR PCB CIRCUITS simplified abstract

AI-BASED COMPONENT PLACEMENT TECHNOLOGY FOR PCB CIRCUITS

Organization Name

Intel Corporation

Inventor(s)

Jianfang Zhu of Portland OR (US)

Adam Norman of Forest Grove OR (US)

Min Suet Lim of Penang (MY)

Miaomiao Ma of Sunnyvale CA (US)

Mackenzie Norman of Portland OR (US)

John Vu of Rancho Cordova CA (US)

Ching Leong Ooi of Penang (MY)

Eng Same Tan of Pinang (MY)

Luis Carlos Alvarez Mata of Cartago (CR)

AI-BASED COMPONENT PLACEMENT TECHNOLOGY FOR PCB CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18326772 titled 'AI-BASED COMPONENT PLACEMENT TECHNOLOGY FOR PCB CIRCUITS

Simplified Explanation

The patent application describes a technology that:

• Receives parameter results and scores from local sessions related to subcircuit components within a specific area.
• Aggregates the parameter results and scores obtained from the local sessions.
• Generates a global placement model based on the aggregated parameter results and scores.
• The technology aims to improve the placement of subcircuit components within a bounded area by utilizing the aggregated data from local sessions.

Original Abstract Submitted

Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.