17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS
Organization Name
Inventor(s)
Hiroki Tanaka of Gilbert AZ (US)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Robert Alan May of Chandler AZ (US)
Sri Ranga Sai Boyapati of Austin TX (US)
Srinivas V. Pietambaram of Chandler AZ (US)
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17847434 titled 'PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS
Simplified Explanation
The abstract describes a microelectronic assembly that includes a package substrate, an interposer, and an integrated circuit (IC) die. The interposer is made of a dielectric material and has a conductive pillar and a conductive structure surrounding the pillar. The IC die is connected to the interposer on the opposite side of the package substrate. The conductive pillar provides a conductive connection between the IC die and the package substrate, while the conductive structure is connected to a ground connection.
- The microelectronic assembly includes a package substrate, an interposer, and an IC die.
- The interposer is made of a dielectric material and has a conductive pillar and a conductive structure.
- The conductive pillar provides a conductive connection between the IC die and the package substrate.
- The conductive structure is connected to a ground connection.
Potential Applications
- Microelectronics manufacturing
- Integrated circuit packaging
- Electronic devices and systems
Problems Solved
- Provides a conductive connection between the IC die and the package substrate
- Ensures proper grounding of the conductive structure
Benefits
- Improved performance and reliability of microelectronic assemblies
- Enhanced electrical connectivity and signal transmission
- Efficient grounding mechanism for the conductive structure
Original Abstract Submitted
Embodiments of a microelectronic assembly comprise a microelectronic assembly, comprising: a package substrate; an interposer coupled to the package substrate, the interposer comprising a dielectric material, a conductive pillar) through the dielectric material and a conductive structure at least partially surrounding the conductive pillar, the conductive structure separated from the conductive pillar by the dielectric material; and an integrated circuit (IC) die coupled to the interposer on a side opposite to the package substrate. The conductive pillar conductively couples the IC die to the package substrate, and the conductive structure is coupled to a ground connection.
