17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)

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SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

Organization Name

Intel Corporation

Inventor(s)

Kavitha Nagarajan of Bangalore (IN)

Eng Huat Goh of Ayer Itam (MY)

Min Suet Lim of Gelugor (MY)

Telesphor Kamgaing of Chandler AZ (US)

Chee Kheong Yoon of Bayan Lepas (MY)

Jooi Wah Wong of Bukit Mertajam (MY)

Chu Aun Lim of Hillsboro OR (US)

SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17848639 titled 'SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

Simplified Explanation

The abstract describes a patent application related to a stiffener for a semiconductor package surface. The stiffener includes slots that allow a gasket to be placed over it, enabling electrical coupling with the ground or VSS of the semiconductor package. The gasket is made of a material that can block or absorb electromagnetic interference (EMI) or radio frequency interference (RFI).

  • The patent application is for a stiffener designed for a semiconductor package surface.
  • The stiffener includes slots that allow a gasket to be placed over it.
  • The gasket is used to electrically couple with the ground or VSS of the semiconductor package.
  • The gasket is made of a material that can block or absorb EMI or RFI.
  • The invention aims to provide improved electrical coupling and EMI/RFI protection for semiconductor packages.

Potential Applications

  • Semiconductor packaging industry
  • Electronics manufacturing industry
  • Telecommunications industry
  • Aerospace industry

Problems Solved

  • Inadequate electrical coupling between the stiffener and the ground/VSS of a semiconductor package.
  • Insufficient protection against EMI or RFI interference in semiconductor packages.

Benefits

  • Enhanced electrical coupling between the stiffener and the ground/VSS of a semiconductor package.
  • Improved protection against EMI or RFI interference in semiconductor packages.
  • Potential reduction in signal interference and improved performance of electronic devices.


Original Abstract Submitted

Embodiments herein relate to systems, apparatuses, or processes directed to a stiffener for a surface of a semiconductor package, where the stiffener includes slots that allow a gasket to go over the stiffener to electrically couple with a ground or a VSS of the semiconductor package. In embodiments, the gasket may include a material that blocks or absorbs EMI or RFI. Other embodiments may be described and/or claimed.

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