TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications published on February 15th, 2024
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Contents
- 1 Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. on February 15th, 2024
- 1.1 ONSITE CLEANING SYSTEM AND METHOD (17884555)
- 1.2 ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM (17887718)
- 1.3 APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING (17885809)
- 1.4 EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF (18123749)
- 1.5 STRUCTURE AND METHOD OF SIGNAL ENHANCEMENT FOR ALIGNMENT PATTERNS (17885870)
- 1.6 INSPECTION METHOD FOR PELLICLE MEMBRANE OF LITHOGRAPHY SYSTEM (17886053)
- 1.7 CONFIGURABLE COMPUTE-IN-MEMORY CIRCUIT AND METHOD (18311124)
- 1.8 CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS (18447788)
- 1.9 METHOD FOR CONTROLLING SENSE AMPLIFIER AND CONTROL DEVICE USING THE SAME (17886423)
- 1.10 Global Boosting Circuit (18351629)
- 1.11 LOW VOLTAGE MEMORY DEVICE (18362736)
- 1.12 MEMORY WITH FRAM AND SRAM OF IC (18492964)
- 1.13 SEMICONDUCTOR MEMORY DEVICES WITH BACKSIDE HEATER STRUCTURE (18165635)
- 1.14 CONDUCTING BUILT-IN SELF-TEST OF MEMORY MACRO (18486789)
- 1.15 SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT (18161859)
- 1.16 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (17887122)
- 1.17 DE-TAPE TOOL (17819307)
- 1.18 ADJUSTABLE WAFER CHUCK (17887729)
- 1.19 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (17887320)
- 1.20 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17887499)
- 1.21 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17886466)
- 1.22 PACKAGE AND FABRICATION METHOD THEREOF (17886461)
- 1.23 THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIAS (MIV) (18447739)
- 1.24 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17884817)
- 1.25 Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die (17887150)
- 1.26 INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME (18151556)
- 1.27 INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY (17819639)
- 1.28 MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE (18496920)
- 1.29 PACKAGE STRUCTURE WITH UNDERFILL (18484571)
- 1.30 NANOSHEET DEVICES AND METHODS OF FABRICATING THE SAME (18165639)
- 1.31 SEMICONDUCTOR DEVICE HAVING MIXED CMOS ARCHITECTURE AND METHOD OF MANUFACTURING SAME (17886145)
- 1.32 NOVEL IMAGE SENSOR DEVICE (18232345)
- 1.33 IMAGE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF (17887983)
- 1.34 DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME (17887194)
- 1.35 Isolation Structures in Semiconductor Devices (18298277)
- 1.36 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE (17886689)
- 1.37 SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME (17886876)
- 1.38 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17886921)
- 1.39 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17887306)
- 1.40 SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF (17886797)
- 1.41 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17885577)
- 1.42 SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME (17887494)
- 1.43 POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK (17819482)
- 1.44 METHOD OF USING SEMICONDUCTOR DEVICE AND METHOD OF MAKING (18492238)
- 1.45 SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF (17887487)
- 1.46 SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF (17886753)
- 1.47 FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME (17886472)
- 1.48 TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR (17887490)
- 1.49 SIDEWALL SPACER STRUCTURE TO INCREASE SWITCHING PERFORMANCE OF FERROELECTRIC MEMORY DEVICE (18493856)
- 1.50 METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY (18494376)
- 1.51 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17886215)
- 1.52 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE (17886433)
- 1.53 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE (18494759)
- 1.54 MULTI-BIT FLIP FLOP (18448027)
- 1.55 SEMICONDUCTOR DEVICE WITH DAISY-CHAINED DELAY CELLS AND METHOD OF FORMING SAME (17822559)
- 1.56 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17887533)
- 1.57 FERROELECTRIC DEVICE AND WAVE COMPUTING DEVICE (17887515)
- 1.58 FERROELECTRIC TUNNEL JUNCTION (FTJ) STRUCTURES (17819244)
- 1.59 PHASE-CHANGE DEVICE STRUCTURE (18150863)
Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. on February 15th, 2024
ONSITE CLEANING SYSTEM AND METHOD (17884555)
Main Inventor
Yen-Hao LIU
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM (17887718)
Main Inventor
Chih-Wen Liu
APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING (17885809)
Main Inventor
Jun-Nan NIAN
EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF (18123749)
Main Inventor
Wen-Chang HSUEH
STRUCTURE AND METHOD OF SIGNAL ENHANCEMENT FOR ALIGNMENT PATTERNS (17885870)
Main Inventor
Hsin-Chieh CHEN
INSPECTION METHOD FOR PELLICLE MEMBRANE OF LITHOGRAPHY SYSTEM (17886053)
Main Inventor
Chia Hao CHANG
CONFIGURABLE COMPUTE-IN-MEMORY CIRCUIT AND METHOD (18311124)
Main Inventor
Xiaoyu SUN
CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS (18447788)
Main Inventor
Shih-Wei PENG
METHOD FOR CONTROLLING SENSE AMPLIFIER AND CONTROL DEVICE USING THE SAME (17886423)
Main Inventor
Jui-Jen Wu
Global Boosting Circuit (18351629)
Main Inventor
Ishan Khera
LOW VOLTAGE MEMORY DEVICE (18362736)
Main Inventor
Mahmut Sinangil
MEMORY WITH FRAM AND SRAM OF IC (18492964)
Main Inventor
Han-Jong CHIA
SEMICONDUCTOR MEMORY DEVICES WITH BACKSIDE HEATER STRUCTURE (18165635)
Main Inventor
Meng-Sheng Chang
CONDUCTING BUILT-IN SELF-TEST OF MEMORY MACRO (18486789)
Main Inventor
Ted Wong
SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT (18161859)
Main Inventor
Shih-Cheng KAO
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (17887122)
Main Inventor
Peng-Soon LIM
DE-TAPE TOOL (17819307)
Main Inventor
Chen Liang Chang
ADJUSTABLE WAFER CHUCK (17887729)
Main Inventor
Chia-Hsi Wang
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (17887320)
Main Inventor
Wei-Ting CHANG
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17887499)
Main Inventor
Yueh-Ting Lin
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17886466)
Main Inventor
Chih-Wei Wu
PACKAGE AND FABRICATION METHOD THEREOF (17886461)
Main Inventor
Chih-Wei Wu
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIAS (MIV) (18447739)
Main Inventor
Shih-Wei Peng
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17884817)
Main Inventor
Cian-Yu CHEN
Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die (17887150)
Main Inventor
Yu-Sheng Lin
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME (18151556)
Main Inventor
Der-Chyang Yeh
INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY (17819639)
Main Inventor
Jen-Yuan Chang
MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE (18496920)
Main Inventor
JEN-YUAN CHANG
PACKAGE STRUCTURE WITH UNDERFILL (18484571)
Main Inventor
Chen-Hsuan TSAI
NANOSHEET DEVICES AND METHODS OF FABRICATING THE SAME (18165639)
Main Inventor
Chia-Chung Chen
SEMICONDUCTOR DEVICE HAVING MIXED CMOS ARCHITECTURE AND METHOD OF MANUFACTURING SAME (17886145)
Main Inventor
Shih-Wei PENG
NOVEL IMAGE SENSOR DEVICE (18232345)
Main Inventor
Chen-Hsiang HUNG
IMAGE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF (17887983)
Main Inventor
Yu-Wei HUANG
DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME (17887194)
Main Inventor
Fu-Chiang KUO
Isolation Structures in Semiconductor Devices (18298277)
Main Inventor
Cheng-Wei Chang
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE (17886689)
Main Inventor
Jung-Chien CHENG
SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME (17886876)
Main Inventor
Kuan-Ting PAN
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17886921)
Main Inventor
Yun Chen TENG
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17887306)
Main Inventor
Ta-Chun LIN
SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF (17886797)
Main Inventor
Cheng-Wei CHANG
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17885577)
Main Inventor
Chia-Hung Chu
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME (17887494)
Main Inventor
Meng-Pei Lu
POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK (17819482)
Main Inventor
Ching-Yu Huang
METHOD OF USING SEMICONDUCTOR DEVICE AND METHOD OF MAKING (18492238)
Main Inventor
Ming Jian WANG
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF (17887487)
Main Inventor
Pinyen Lin
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF (17886753)
Main Inventor
Guan-Lin CHEN
FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME (17886472)
Main Inventor
Kuo-Chang Chiang
TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR (17887490)
Main Inventor
Georgios Vellianitis
SIDEWALL SPACER STRUCTURE TO INCREASE SWITCHING PERFORMANCE OF FERROELECTRIC MEMORY DEVICE (18493856)
Main Inventor
Han-Jong Chia
METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY (18494376)
Main Inventor
Kuo-Chiang TSAI
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17886215)
Main Inventor
Yu-Lien HUANG
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE (17886433)
Main Inventor
Yu-Chi LIN
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE (18494759)
Main Inventor
Jiun-Ming Kuo
MULTI-BIT FLIP FLOP (18448027)
Main Inventor
Chi-Lin Liu
SEMICONDUCTOR DEVICE WITH DAISY-CHAINED DELAY CELLS AND METHOD OF FORMING SAME (17822559)
Main Inventor
Huaixin XIAN
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17887533)
Main Inventor
Ming-Fa Chen
FERROELECTRIC DEVICE AND WAVE COMPUTING DEVICE (17887515)
Main Inventor
Gerben DOORNBOS
FERROELECTRIC TUNNEL JUNCTION (FTJ) STRUCTURES (17819244)
Main Inventor
Kuen-Yi Chen
PHASE-CHANGE DEVICE STRUCTURE (18150863)
Main Inventor
Fu-Ting Sung
