18447788. CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shih-Wei Peng of Hsinchu City (TW)

Jiann-Tyng Tzeng of Hsin Chu (TW)

Kam-Tou Sio of Zhubei City (TW)

CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447788 titled 'CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS

Simplified Explanation

The patent application discloses various memory cell structures and power routings in an integrated circuit to improve power distribution and reduce IR drop.

• Different metal layers are used for power stripes to connect to voltage sources and supply different voltage signals.
• Fewer metal stripes are used for signals to allow power stripes to have a larger width, reducing IR drop.
• Metal pillars in one layer are connected to power stripes in another layer for efficient power routing.
• Metal stripes are extended in one layer to provide additional connections to power stripes in another layer.

Potential applications of this technology:

• Integrated circuits
• Memory devices
• Microprocessors

Problems solved by this technology:

• IR drop across power stripes
• Efficient power distribution
• Signal integrity in integrated circuits

Benefits of this technology:

• Improved power routing
• Reduced IR drop
• Enhanced performance of integrated circuits

Original Abstract Submitted

Various memory cell structures and power routings for one or more cells in an integrated circuit are disclosed. In one embodiment, different metal layers are used for power stripes that are operable to connect to voltage sources to supply different voltage signals, which allows some or all of the power stripes to have a larger width. Additionally or alternatively, fewer metal stripes are used for signals in a metal layer to allow the power stripe in that metal layer to have a larger width. The larger width(s) in turn increases the total area of the power stripe(s) to reduce the IR drop across the power stripe. The various power routings include connecting metal pillars in one metal layer to a power stripe in another metal layer, and extending a metal stripe in one metal layer to provide additional connections to a power stripe in another metal layer.