17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chih-Wen Liu of Taoyuan City (TW)

Yeo-Sin Lin of Taichung City (TW)

Shu-Wei Hsu of Taipei City (TW)

Che-Hao Tu of Hsinchu City (TW)

Hui-Chi Huang of Zhubei City (TW)

Kei-Wei Chen of Tainan City (TW)

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17887718 titled 'ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

Simplified Explanation

The patent application describes a process tool for polishing wafers using an abrasive slurry and charged abrasive particles.

  • Polishing pad on top surface of wafer platen
  • Wafer carrier holds wafer over polishing pad
  • Slurry dispenser dispenses abrasive slurry with charged abrasive particles onto pad
  • First conductive rod in wafer platen connected to first voltage supply
  • Wafer roller supports wafer
  • First wafer brush beside wafer roller
  • Second conductive rod in first wafer brush connected to second voltage supply
  • First voltage supply applies charge with second polarity to first conductive rod
  • Second voltage supply applies charge with second polarity to second conductive rod

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      1. Potential Applications
  • Semiconductor manufacturing
  • Microelectronics industry
  • Wafer polishing processes
      1. Problems Solved
  • Efficient and precise wafer polishing
  • Control of abrasive particles during polishing
  • Reduction of defects on wafers
      1. Benefits
  • Improved polishing uniformity
  • Enhanced control over polishing process
  • Increased productivity in wafer manufacturing


Original Abstract Submitted

A process tool including a polishing pad on a top surface of a wafer platen. A wafer carrier is configured to hold a wafer over the polishing pad. A slurry dispenser is configured to dispense an abrasive slurry including a plurality of charged abrasive particles having a first polarity onto the polishing pad. A first conductive rod is within the wafer platen and coupled to a first voltage supply. A wafer roller is configured to support the wafer. A first wafer brush is arranged beside the wafer roller. A second conductive rod is within the first wafer brush and coupled to a second voltage supply. The first voltage supply is configured to apply a first charge having a second polarity, opposite the first polarity, to the first conductive rod. The second voltage supply is configured to apply a second charge having the second polarity to the second conductive rod.

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