17887499. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yueh-Ting Lin of Taipei City (TW)
Hua-Wei Tseng of New Taipei City (TW)
An-Jhih Su of Taoyuan City (TW)
Ming-Shih Yeh of Hsinchu County (TW)
Der-Chyang Yeh of Hsin-Chu (TW)
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17887499 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor structure described in the patent application includes a package with a redistribution structure and at least one die, an electrical device, and an underfill material. The die is placed on one side of the redistribution structure, while the electrical device is placed on the other side with its top surface facing the redistribution structure. The underfill material is positioned between the top surface of the electrical device and the redistribution structure, extending towards the bottom surface of the device.
- Package includes redistribution structure and at least one die
- Electrical device placed on opposite side of redistribution structure with top surface facing it
- Underfill material positioned between top surface of electrical device and redistribution structure
- Underfill material has flat end surface corresponding to bottom surface of electrical device
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- Potential Applications
- Semiconductor manufacturing
- Electronics industry
- Problems Solved
- Improved thermal management
- Enhanced reliability of electrical devices
- Better protection against mechanical stress
- Benefits
- Increased performance and longevity of semiconductor devices
- Improved overall quality of electronic products
- Enhanced durability and resistance to external factors
Original Abstract Submitted
A semiconductor structure includes a package, an electrical device and an underfill material. The package includes a redistribution structure and at least one die, and the at least one die is disposed on a first side of the redistribution structure. The electrical device is disposed on a second side of the redistribution structure, the electrical device has a top surface and a bottom surface opposite to each other, and the top surface faces the redistribution structure. The underfill material is disposed between the top surface and the redistribution structure and extending toward the bottom surface, the underfill material has an end surface corresponding to the bottom surface, and the end surface is a flat surface. In addition, a manufacturing method of the semiconductor structure is also provided.
