17819307. DE-TAPE TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
DE-TAPE TOOL
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chen Liang Chang of Taipei (TW)
Kuo Hui Chang of Taoyuan County (TW)
DE-TAPE TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 17819307 titled 'DE-TAPE TOOL
Simplified Explanation
The abstract describes a method for removing a sacrificial substructure from a support structure, which involves applying a barrier, puncturing the sacrificial substructure, and detaching it from the support structure.
- The method involves receiving a support structure with a sacrificial substructure connected, from which electrical devices have been removed.
- A barrier is applied to the sacrificial substructure to prepare it for removal.
- The sacrificial substructure is punctured with a puncture plate to secure it in place.
- The sacrificial substructure is detached from the support structure by moving the puncture plate.
- Potential Applications
- Semiconductor manufacturing
- Microelectronics fabrication
- MEMS (Micro-Electro-Mechanical Systems) production
- Problems Solved
- Efficient removal of sacrificial substructures
- Preventing damage to support structures during removal process
- Ensuring proper detachment of sacrificial substructures
- Benefits
- Improved manufacturing processes
- Reduced risk of damage to delicate structures
- Enhanced precision in device fabrication
Original Abstract Submitted
A method of removing a sacrificial substructure from a support structure is disclosed. The method includes receiving the support structure, where the support structure has the sacrificial substructure connected thereto, the sacrificial substructure having functioning electrical devices removed therefrom. The method also includes applying a barrier to the sacrificial substructure, puncturing the sacrificial substructure with a puncture plate to secure the sacrificial substructure to the puncture plate, and detaching the sacrificial substructure from the support structure by moving the puncture plate with respect to the support structure.
