17886466. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chih-Wei Wu of Yilan County (TW)
Ying-Ching Shih of Hsinchu City (TW)
An-Jhih Su of Taoyuan City (TW)
Wen-Chih Chiou of Miaoli County (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17886466 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes an interposer substrate, multiple semiconductor dies, heat dissipation elements, and an encapsulant. The semiconductor dies are placed on the interposer substrate, while the heat dissipation elements are positioned on top of the semiconductor dies. The encapsulant covers the interposer substrate, semiconductor dies, and heat dissipation elements.
- Interposer substrate for mounting semiconductor dies
- Multiple semiconductor dies placed on the interposer substrate
- Heat dissipation elements placed on top of the semiconductor dies
- Encapsulant covering the interposer substrate, semiconductor dies, and heat dissipation elements
Potential Applications
- High-performance computing
- Data centers
- Automotive electronics
Problems Solved
- Improved thermal management
- Enhanced reliability of semiconductor devices
- Increased performance of electronic systems
Benefits
- Better heat dissipation
- Higher reliability
- Improved overall performance of electronic devices
Original Abstract Submitted
Disclosed are a semiconductor package and a manufacturing method of a semiconductor package. In one embodiment, the semiconductor package includes an interposer substrate, a plurality of semiconductor dies, one or more heat dissipation elements and an encapsulant. The plurality of semiconductor dies are disposed on the interposer substrate. The one or more heat dissipation elements are disposed on the plurality of semiconductor dies. The encapsulant is disposed on the interposer substrate and surrounds the plurality of semiconductor dies and the one or more heat dissipation elements.
