17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Jen-Yuan Chang of Hsinchu (TW)

INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 17819639 titled 'INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY

Simplified Explanation

The integrated semiconductor packaging system described in the abstract includes:

• A first wet clean tool for cleaning a frame with top dies.
• A second wet clean tool for cleaning a wafer with bottom dies.
• A pick-and-place tool for bonding top dies to bottom dies.
• A first transmission path for transferring the frame and wafer to the pick-and-place tool.

• • Potential Applications:**
• Semiconductor manufacturing
• Integrated circuit packaging

• • Problems Solved:**
• Ensures cleanliness of frames and wafers before bonding dies.
• Streamlines the process of transferring components between cleaning and bonding tools.

• • Benefits:**
• Improved quality and reliability of semiconductor packages.
• Increased efficiency in the packaging process.
• Reduced risk of contamination during die bonding.

Original Abstract Submitted

An integrated semiconductor packaging system includes: a first wet clean tool configured to perform a first wet clean process on a frame, wherein a plurality of top dies are disposed on the frame; a second wet clean tool configured to perform a second wet clean process on a wafer, wherein a plurality of bottom dies corresponding to the plurality of top dies, respectively, are disposed on the wafer; a pick-and-place tool configured to bond the plurality of top dies to the plurality of bottom dies, respectively; and a first transmission path through which the frame and the wafer are transferred from the first wet clean tool and the second wet clean tool to the pick-and-place tool, respectively, wherein the frame is directly transferred from the first wet clean tool to the pick-and-place tool, and the wafer is directly transferred from the second wet clean tool to the pick-and-place tool.