17887150. Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chin-Fu Kao of Taipei City (TW)
Tsung-Yang Hsieh of Taipei City (TW)
Jyun-Lin Wu of Hsinchu City (TW)
Yao-Chun Chuang of Hsinchu City (TW)
Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die - A simplified explanation of the abstract
This abstract first appeared for US patent application 17887150 titled 'Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die
Simplified Explanation
The patent application describes an integrated circuit (IC) system where two IC dies are connected by a third die, each with different surface orientations on their substrates.
- First IC die with a first substrate
- Second IC die with a second substrate
- First surface orientation on either first or second substrate
- Third die electrically interconnects the first and second IC dies
- Third die has a third substrate with a different second surface orientation
Potential Applications:
- Advanced electronic devices
- Communication systems
- Computing systems
Problems Solved:
- Efficiently connecting IC dies with different surface orientations
- Improving overall system performance and reliability
Benefits:
- Enhanced functionality and connectivity in electronic systems
- Increased flexibility in design and integration of IC components
- Improved performance and reliability of integrated circuits
Original Abstract Submitted
A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate or the second substrate has a first surface orientation. The first IC die is spaced apart from the second IC die. A third die electrically interconnects the first IC die to the second IC die. The third die includes a third substrate having a second surface orientation. The second surface orientation is different from the first surface orientation.
