18484571. PACKAGE STRUCTURE WITH UNDERFILL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
PACKAGE STRUCTURE WITH UNDERFILL
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chen-Hsuan Tsai of Taitung City (TW)
Tsung-Fu Tsai of Changhua City (TW)
Shih-Ting Lin of Taipei City (TW)
Szu-Wei Lu of Hsinchu City (TW)
PACKAGE STRUCTURE WITH UNDERFILL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18484571 titled 'PACKAGE STRUCTURE WITH UNDERFILL
Simplified Explanation
The abstract describes a package structure for a semiconductor chip, which includes a protective frame surrounding the chip and an underfill element between the chip and the frame.
- The package structure consists of a substrate and a semiconductor chip placed on the substrate.
- A protective frame is positioned around the semiconductor chip to provide lateral protection.
- An underfill element is present between the semiconductor chip and the protective frame.
- A portion of the underfill element is directly below the protective frame to provide support and stability to the structure.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Protection of semiconductor chips from external damage
- Enhanced structural integrity of package structure
Benefits
- Improved reliability of semiconductor devices
- Increased durability of package structure
- Enhanced performance of electronic components
Original Abstract Submitted
A package structure is provided. The package structure includes a substrate and a semiconductor chip over the substrate. The package structure also includes a protective frame laterally surrounding the semiconductor chip. The package structure further includes an underfill element between the semiconductor chip and the protective frame. A portion of the underfill element is directly below the protective frame.
