Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on October 26th, 2023
Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on October 26th, 2023
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to integrated chips, memory devices, interconnect structures, and manufacturing methods. These patents demonstrate TSMC's focus on developing innovative technologies for the semiconductor industry.
Summary of Recent Patents:
- Integrated Chip with Multiple Layers: TSMC has developed an integrated chip that includes multiple layers of conductive and dielectric materials. The chip features a data storage structure consisting of three dielectric layers with different bandgaps, providing enhanced performance and functionality.
- Memory Device with Shielding Element: TSMC has designed a memory device that includes a memory unit and a shielding element. The shielding element is placed on the memory unit to redirect any external magnetic field away from the memory element, ensuring reliable and stable operation.
- Interconnect Structure with Conductive Pad and Capping Layer: TSMC has developed an interconnect structure with two interconnect elements. The structure includes a conductive pad layer covered by a capping layer made of titanium nitride, providing improved conductivity and protection against oxidation.
- Integrated Chip with Fin Structure and Ferroelectric Memory Stack: TSMC has created an integrated chip with a fin structure extending vertically from a semiconductor substrate. The fin structure is covered by a ferroelectric memory stack, which extends laterally in a different direction. This design allows for efficient memory storage and retrieval.
- Memory Device with Stacking Structure and Conductive Pillars: TSMC has developed a memory device with multiple layers stacked on top of each other. The device includes a stacking structure made up of alternating isolation layers and word lines, as well as conductive pillars aligned perpendicular to the layers.
Notable Applications:
- Inline Tin Stream Monitor (ITSM) system for accurate measurement and estimation of tin levels in an in-line refill system.
- Automatic gain adjustor for a hybrid oscillator to overcome frequency limitations of hybrid phase lock loops (PLLs), allowing for precise frequency control.
These recent patents and applications demonstrate TSMC's commitment to advancing semiconductor technology and addressing key challenges in the industry. Through innovative designs and manufacturing methods, TSMC aims to enhance the performance, reliability, and efficiency of integrated chips and memory devices.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on October 26th, 2023
- 1.1 METHOD OF USING POLISHING PAD (18341421)
- 1.2 INTEGRATED OPTICAL DEVICES AND METHODS OF FORMING THE SAME (17725558)
- 1.3 METHOD OF FABRICATING AND SERVICING A PHOTOMASK (18210551)
- 1.4 PHOTORESIST COMPOSITION WITH NOVEL SOLVENT (17726036)
- 1.5 CHIP POWER CONSUMPTION ANALYZER AND ANALYZING METHOD THEREOF (17829376)
- 1.6 METHOD FOR INTRA-CELL-REPURPOSING DUMMY TRANSISTORS AND SEMICONDUCTOR DEVICE HAVING REPURPOSED FORMERLY DUMMY TRANSISTORS (17743374)
- 1.7 INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME (18333259)
- 1.8 CAPTURE IR DROP ANALYZER AND ANALYZING METHOD THEREOF (17844083)
- 1.9 STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME (18333392)
- 1.10 DUO-LEVEL WORD LINE DRIVER (18345071)
- 1.11 MEMORY DEVICE AND OPERATING METHOD OF THE SAME (18345530)
- 1.12 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (17660169)
- 1.13 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (17660249)
- 1.14 SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18216468)
- 1.15 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURE (17879595)
- 1.16 SEMICONDUCTOR DEVICE WITH T-SHAPED ACTIVE REGION AND METHODS OF FORMING SAME (17742272)
- 1.17 Mechanism for FinFET Well Doping (18346622)
- 1.18 SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (17660518)
- 1.19 SEMICONDUCTOR DEVICE STRUCTURE (18347264)
- 1.20 FILM SCHEME TO REDUCE PLASMA-INDUCED DAMAGE (17856419)
- 1.21 TESTING MODULE AND METHOD FOR USING THE SAME (17724928)
- 1.22 SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTURING METHOD THEREOF (17727820)
- 1.23 INTEGRATED CHIP HAVING A BACK-SIDE POWER RAIL (18341831)
- 1.24 SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA AND METHOD OF MAKING (17727504)
- 1.25 PAD STRUCTURE FOR ENHANCED BONDABILITY (18340092)
- 1.26 PACKAGE STRUCTURE (18336258)
- 1.27 CHIP PACKAGE STRUCTURE (18344039)
- 1.28 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18342752)
- 1.29 FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME (17726494)
- 1.30 INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME (18342749)
- 1.31 PACKAGE STRUCTURE (17727841)
- 1.32 SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE (18342755)
- 1.33 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18215059)
- 1.34 SEMICONDUCTOR DEVICES WITH GATE ISOLATION STRUCTIONS AND METHODS OF MANUFACTURING THEREOF (18345068)
- 1.35 SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR (18215707)
- 1.36 MULTI-LATERAL RECESSED MIM STRUCTURE (18342861)
- 1.37 EPITAXIAL STRUCTURES GROWN ON MATERIAL WITH A CRYSTALLOGRAPHIC ORIENTATION OF {110} ([[US Patent Application 17660818. EPITAXIAL STRUCTURES GROWN ON MATERIAL WITH A CRYSTALLOGRAPHIC ORIENTATION OF {110} simplified abstract|17660818]])
- 1.38 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17726522)
- 1.39 SEMICONDUCTOR GATE AND CONTACT FORMATION (17660241)
- 1.40 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17876331)
- 1.41 SEMICONDUCTOR STRUCTURE (17727846)
- 1.42 TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERATING SPACERS FOR A SEMICONDUCTOR DEVICE DRAIN (18342048)
- 1.43 FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME (18344581)
- 1.44 INTEGRATED CIRCUIT STRUCTURE (18340454)
- 1.45 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (17726812)
- 1.46 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17727737)
- 1.47 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18216560)
- 1.48 GATE ALL AROUND STRUCTURE WITH ADDITIONAL SILICON LAYER AND METHOD FOR FORMING THE SAME (18344057)
- 1.49 FULL WELL CAPACITY FOR IMAGE SENSOR (18335171)
- 1.50 IMAGE SENSOR STRUCTURE (17835049)
- 1.51 DUAL MODE SUPPLY CIRCUIT AND METHOD (18343425)
- 1.52 METHOD FOR OPERATING SEMICONDUCTOR DEVICE INCLUDING MULTI-GATED I/O SYSTEM (18218080)
- 1.53 Automatic Hybrid Oscillator Gain Adjustor Circuit (18344120)
- 1.54 METHOD AND APPARATUS FOR MONITORING AN EXTREME ULTRAVIOLET RADIATION SOURCE (17727479)
- 1.55 FLOATING GATE TEST STRUCTURE FOR EMBEDDED MEMORY DEVICE (18344161)
- 1.56 INTEGRATED CHIP WITH A GATE STRUCTURE DISPOSED WITHIN A TRENCH (18335168)
- 1.57 MEMORY DEVICE COMPRISING CONDUCTIVE PILLARS (18341764)
- 1.58 THREE-DIMENSIONAL MEMORY DEVICE WITH WORD LINES EXTENDING THROUGH SUB-ARRAYS, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE SAME (18346278)
- 1.59 FIN STRUCTURE FOR INCREASING PERFORMANCE OF FERROELECTRIC MEMORY DEVICE (17724937)
- 1.60 Defect Reduction Through Scheme Of Conductive Pad Layer And Capping Layer (17890883)
- 1.61 MAGNETIC MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME (17726981)
- 1.62 DATA STORAGE STRUCTURE FOR IMPROVING MEMORY CELL RELIABILITY (18335176)
Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on October 26th, 2023
METHOD OF USING POLISHING PAD (18341421)
Main Inventor
ChunHung CHEN
INTEGRATED OPTICAL DEVICES AND METHODS OF FORMING THE SAME (17725558)
Main Inventor
Feng-Wei Kuo
METHOD OF FABRICATING AND SERVICING A PHOTOMASK (18210551)
Main Inventor
Chun-Fu YANG
PHOTORESIST COMPOSITION WITH NOVEL SOLVENT (17726036)
Main Inventor
An-Ren ZI
CHIP POWER CONSUMPTION ANALYZER AND ANALYZING METHOD THEREOF (17829376)
Main Inventor
Sin-Huei Li
METHOD FOR INTRA-CELL-REPURPOSING DUMMY TRANSISTORS AND SEMICONDUCTOR DEVICE HAVING REPURPOSED FORMERLY DUMMY TRANSISTORS (17743374)
Main Inventor
Yiyun HUANG
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME (18333259)
Main Inventor
Shih-Wei PENG
CAPTURE IR DROP ANALYZER AND ANALYZING METHOD THEREOF (17844083)
Main Inventor
Chen-Yuan Kao
STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME (18333392)
Main Inventor
Chih-Yu LIN
DUO-LEVEL WORD LINE DRIVER (18345071)
Main Inventor
Po-Hao Lee
MEMORY DEVICE AND OPERATING METHOD OF THE SAME (18345530)
Main Inventor
Gu-Huan LI
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (17660169)
Main Inventor
Yi Chen HO
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (17660249)
Main Inventor
Liang Yu CHEN
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18216468)
Main Inventor
Jing Hong HUANG
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURE (17879595)
Main Inventor
Shahaji B. MORE
SEMICONDUCTOR DEVICE WITH T-SHAPED ACTIVE REGION AND METHODS OF FORMING SAME (17742272)
Main Inventor
Huaixin XIAN
Mechanism for FinFET Well Doping (18346622)
Main Inventor
Chun Hsiung Tsai
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (17660518)
Main Inventor
Ying-Yu LAI
SEMICONDUCTOR DEVICE STRUCTURE (18347264)
Main Inventor
Chun-Hung LIAO
FILM SCHEME TO REDUCE PLASMA-INDUCED DAMAGE (17856419)
Main Inventor
Chia-Wen Zhong
TESTING MODULE AND METHOD FOR USING THE SAME (17724928)
Main Inventor
Jen-Yuan CHANG
SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTURING METHOD THEREOF (17727820)
Main Inventor
Wei-Ming Wang
INTEGRATED CHIP HAVING A BACK-SIDE POWER RAIL (18341831)
Main Inventor
Shin-Yi Yang
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA AND METHOD OF MAKING (17727504)
Main Inventor
Chih-Yu LAI
PAD STRUCTURE FOR ENHANCED BONDABILITY (18340092)
Main Inventor
Ru-Ying Huang
PACKAGE STRUCTURE (18336258)
Main Inventor
Po-Chen LAI
CHIP PACKAGE STRUCTURE (18344039)
Main Inventor
Po-Chen LAI
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18342752)
Main Inventor
Hsien-Wei Chen
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME (17726494)
Main Inventor
Yi-Jung Chen
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME (18342749)
Main Inventor
Chia-Hao Hsu
PACKAGE STRUCTURE (17727841)
Main Inventor
Lipu Kris Chuang
SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE (18342755)
Main Inventor
Hsien-Wei Chen
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18215059)
Main Inventor
Chia-Wen CHANG
SEMICONDUCTOR DEVICES WITH GATE ISOLATION STRUCTIONS AND METHODS OF MANUFACTURING THEREOF (18345068)
Main Inventor
Ya-Yi Tsai
SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR (18215707)
Main Inventor
Hong-Yang CHEN
MULTI-LATERAL RECESSED MIM STRUCTURE (18342861)
Main Inventor
Alexander Kalnitsky
EPITAXIAL STRUCTURES GROWN ON MATERIAL WITH A CRYSTALLOGRAPHIC ORIENTATION OF {110} ([[US Patent Application 17660818. EPITAXIAL STRUCTURES GROWN ON MATERIAL WITH A CRYSTALLOGRAPHIC ORIENTATION OF {110} simplified abstract|17660818]])
Main Inventor
Wei-Min Liu
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17726522)
Main Inventor
Ren-Kai Chen
SEMICONDUCTOR GATE AND CONTACT FORMATION (17660241)
Main Inventor
Hsin-Han TSAI
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17876331)
Main Inventor
Shang-Wen CHANG
SEMICONDUCTOR STRUCTURE (17727846)
Main Inventor
Yen-Ching Wu
TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERATING SPACERS FOR A SEMICONDUCTOR DEVICE DRAIN (18342048)
Main Inventor
Tzu-Yang HO
FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME (18344581)
Main Inventor
Chen-Ping Chen
INTEGRATED CIRCUIT STRUCTURE (18340454)
Main Inventor
Wei-Hao LU
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (17726812)
Main Inventor
An-Hung TAI
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17727737)
Main Inventor
Jenn-Gwo HWU
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18216560)
Main Inventor
Chun-Sheng LIANG
GATE ALL AROUND STRUCTURE WITH ADDITIONAL SILICON LAYER AND METHOD FOR FORMING THE SAME (18344057)
Main Inventor
Chen-Han WANG
FULL WELL CAPACITY FOR IMAGE SENSOR (18335171)
Main Inventor
Kai-Yun Yang
IMAGE SENSOR STRUCTURE (17835049)
Main Inventor
Hsiang-Lin Chen
DUAL MODE SUPPLY CIRCUIT AND METHOD (18343425)
Main Inventor
Wei LI
METHOD FOR OPERATING SEMICONDUCTOR DEVICE INCLUDING MULTI-GATED I/O SYSTEM (18218080)
Main Inventor
Shao-Te WU
Automatic Hybrid Oscillator Gain Adjustor Circuit (18344120)
Main Inventor
Tsung-Hsien Tsai
METHOD AND APPARATUS FOR MONITORING AN EXTREME ULTRAVIOLET RADIATION SOURCE (17727479)
Main Inventor
Yu-Kuang SUN
FLOATING GATE TEST STRUCTURE FOR EMBEDDED MEMORY DEVICE (18344161)
Main Inventor
Hung-Ling Shih
INTEGRATED CHIP WITH A GATE STRUCTURE DISPOSED WITHIN A TRENCH (18335168)
Main Inventor
Yong-Sheng Huang
MEMORY DEVICE COMPRISING CONDUCTIVE PILLARS (18341764)
Main Inventor
Yu-Wei Jiang
THREE-DIMENSIONAL MEMORY DEVICE WITH WORD LINES EXTENDING THROUGH SUB-ARRAYS, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE SAME (18346278)
Main Inventor
Meng-Han Lin
FIN STRUCTURE FOR INCREASING PERFORMANCE OF FERROELECTRIC MEMORY DEVICE (17724937)
Main Inventor
Kuen-Yi Chen
Defect Reduction Through Scheme Of Conductive Pad Layer And Capping Layer (17890883)
Main Inventor
Ching Ju Yang
MAGNETIC MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME (17726981)
Main Inventor
Hung-Cho WANG
DATA STORAGE STRUCTURE FOR IMPROVING MEMORY CELL RELIABILITY (18335176)
Main Inventor
Hai-Dang Trinh
