US Patent Application 18342749. INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME simplified abstract

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INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Chia-Hao Hsu of Hsinchu (TW)


Yung-Chi Lin of New Taipei City (TW)


Wen-Chih Chiou of Miaoli County (TW)


INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18342749 Titled 'INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME'

Simplified Explanation

The abstract describes integrated circuit packages and the methods used to create them. These packages consist of multiple components, including at least one first die, a group of bumps, a second die, and a dielectric layer. The bumps are connected to the first die on one side, while the second die is connected to the first die on the opposite side. The dielectric layer is placed between the first die and the second die, covering the side of the first die.


Original Abstract Submitted

Provided are integrated circuit packages and methods of forming the same. An integrated circuit package includes at least one first die, a plurality of bumps, a second die and a dielectric layer. The bumps are electrically connected to the at least one first die at a first side of the at least one first die. The second die is electrically connected to the at least one first die at a second side of the at least one first die. The second side is opposite to the first side of the at least one first die. The dielectric layer is disposed between the at least one first die and the second die and covers a sidewall of the at least one first die.

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