US Patent Application 18216468. SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract

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SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Jing Hong Huang of Kaohsiung City (TW)


Ching-Yu Chang of Yuansun Village (TW)


Wei-Han Lai of New Taipei City (TW)


SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18216468 Titled 'SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE'

Simplified Explanation

The abstract describes a composition that includes a carbon backbone polymer, a first crosslinker, and a second crosslinker. The first crosslinker partially crosslinks the carbon backbone polymer at a temperature between 100°C and 170°C, while the second crosslinker fully crosslinks the carbon backbone polymer at a temperature between 180°C and 300°C. The first crosslinker is chosen from a group of compounds that have the structure A-(OR) or A-(NR).


Original Abstract Submitted

A composition, comprising: a carbon backbone polymer; a first crosslinker; and a second crosslinker. The first crosslinker partially crosslinks the carbon backbone polymer at a temperature ranging from 100° C. to 170° C., and the second crosslinker crosslinks the carbon backbone polymer at a temperature ranging from 180 20 C. to 300° C. The first crosslinker is one or more selected from the group consisting of A-(OR), A-(NR),

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