US Patent Application 18341421. METHOD OF USING POLISHING PAD simplified abstract
Contents
METHOD OF USING POLISHING PAD
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng-Chen Wang of Hsinchu (TW)
Shih-Sian Huang of Hsinchu (TW)
METHOD OF USING POLISHING PAD - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18341421 Titled 'METHOD OF USING POLISHING PAD'
Simplified Explanation
This abstract describes a method of using a polishing pad. The method involves applying a slurry to a specific location on the polishing pad and then rotating the pad. The slurry is spread across different regions of the pad at different rates. The first region, which has a set of grooves, is spread at a certain rate. The second region, which surrounds the first region and also has grooves, is spread at a different rate. Finally, the third region, which surrounds the second region and has its own set of grooves, is spread at a slower rate than the first two regions.
Original Abstract Submitted
A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.
