US Patent Application 17660518. SEMICONDUCTOR DEVICE AND METHODS OF FORMATION simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Yun Wang of Kaohsiung City (TW)
Chih-Hsuan Lin of Hsinchu City (TW)
Hsi Chung Chen of Tainan City (TW)
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17660518 Titled 'SEMICONDUCTOR DEVICE AND METHODS OF FORMATION'
Simplified Explanation
Multiple dry etching operations are used to create an opening for an interconnect structure in a semiconductor device. In between these dry etching operations, a wet cleaning operation is performed. This multi-step etch approach improves the removal of leftover materials, resulting in a higher quality interconnect structure. It also reduces the chances of under etching, leading to better semiconductor device yield and performance.
Original Abstract Submitted
Multiple dry etching operations are performed to form an opening for an interconnect structure, with a wet cleaning operation performed in between the dry etching operations. This multi-step etch approach increases the effectiveness of residual material removal, which increases the quality of the interconnect structure and reduces the likelihood of under etching, both of which increase semiconductor device yield and semiconductor device performance.
