US Patent Application 18344039. CHIP PACKAGE STRUCTURE simplified abstract
Contents
CHIP PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Po-Chen Lai of Hsinchu County (TW)
Chin-Hua Wang of New Taipei City (TW)
Ming-Chih Yew of Hsinchu City (TW)
Chia-Kuei Hsu of Hsinchu City (TW)
Li-Ling Liao of Hsinchu City (TW)
Po-Yao Lin of Hsinchu County (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18344039 Titled 'CHIP PACKAGE STRUCTURE'
Simplified Explanation
The abstract describes a chip package structure that includes a redistribution structure with multiple wiring layers. There is also a shield bump structure that is insulated from the wiring layers. The structure includes a first chip that is bonded to the redistribution structure and is insulated from the shield bump structure. The first chip partially overlaps the shield bump structure. Additionally, there is a second chip that is also bonded to the redistribution structure.
Original Abstract Submitted
A chip package structure is provided. The chip package structure includes a redistribution structure including a dielectric structure and a plurality of wiring layers in or over the dielectric structure. The chip package structure includes a shield bump structure over the redistribution structure and electrically insulated from the wiring layers. The chip package structure includes a first chip structure bonded to the redistribution structure. The first chip structure is electrically insulated from the shield bump structure, and the first chip structure partially overlaps the shield bump structure. The chip package structure includes a second chip structure bonded to the redistribution structure.
