US Patent Application 17727841. PACKAGE STRUCTURE simplified abstract
Contents
PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Lipu Kris Chuang of Hsinchu City (TW)
Tzu-Sung Huang of Tainan City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17727841 Titled 'PACKAGE STRUCTURE'
Simplified Explanation
The abstract describes a package structure that includes a chip stacking structure, a thermal enhance component, and an insulating encapsulant. The thermal enhance component is placed on top of the chip stacking structure and is thermally connected to it. The thermal enhance component has a larger size in one direction compared to the chip stacking structure. The first insulating encapsulant surrounds both the thermal enhance component and the chip stacking structure.
Original Abstract Submitted
A package structure including a chip stacking structure, a thermal enhance component and a first insulating encapsulant is provided. The thermal enhance component is stacked over and thermally coupled to the chip stacking structure, wherein a first lateral dimension of the thermal enhance component is greater than a second lateral dimension of the chip stacking structure. The first insulating encapsulant laterally encapsulates the thermal enhance component and the chip stacking structure.
