US Patent Application 17726494. FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME simplified abstract

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Yi-Jung Chen of Yilan County (TW)

Tsung-Fu Tsai of Changhua County (TW)

Szu-Wei Lu of Hsinchu City (TW)

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME - A simplified explanation of the abstract

• This abstract for appeared for US patent application number 17726494 Titled 'FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME'

Simplified Explanation

This abstract describes a method for bonding semiconductor dies using a flip-chip technique. The process involves several steps: 1. A wafer with multiple semiconductor dies is placed on an adhesive film held by a frame element. 2. A semiconductor die is lifted from the wafer using an ejector element. 3. The lifted die is then picked up by a collector element. 4. The collector element flips the die and aligns it with the desired position. 5. An alignment check is performed to determine the position of the die and the tolerance between the collector element and the die's center. 6. Based on the alignment check, the die with the collector element is transferred to a location underneath a bonder element. 7. The bonder element picks up the die from the collector element. 8. Finally, the bonder element bonds the die to a carrier.

Overall, this method provides a way to efficiently bond semiconductor dies using a flip-chip technique, ensuring accurate alignment and bonding.

Original Abstract Submitted

A flip-chip bonding method includes following operations. A wafer is provided with multiple semiconductor dies on an adhesive film held by a frame element. A semiconductor die is lifted up from the wafer by an ejector element. The semiconductor die is picked up with a collector element. The semiconductor die is flip-chipped with the collector element. An alignment check is performed to determine a position of the semiconductor die, so as to determine a process tolerance between a center of the collector element and a center of the semiconductor die. The semiconductor die with the collector element is transferred to a location underneath a bonder element based on the process tolerance of the alignment check. The semiconductor die is picked up from the collector element by the bonder element. The semiconductor die is bonded to a carrier by the bonder element.