US Patent Application 18342755. SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE simplified abstract

SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE - A simplified explanation of the abstract

• This abstract for appeared for US patent application number 18342755 Titled 'SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE'

Simplified Explanation

The abstract describes a semiconductor structure that consists of two main components: an encapsulated electronic die and a photonic die. The electronic die is covered by an insulating layer, and the photonic die is connected to the encapsulated die. The photonic die includes an optical device near its edge coupling facet. In a top-down view, the boundary of the electronic die is contained within the boundary of the insulating layer, and the boundary of the insulating layer is contained within the boundary of the photonic die.

Original Abstract Submitted

A semiconductor structure includes an encapsulated die including an electronic die and an insulating layer laterally covering the electronic die, and a photonic die coupled to the encapsulated die. The photonic die includes an optical device in proximity to an edge coupling facet of the photonic die. In a top-down view, a boundary of the electronic die is within a boundary of the insulating layer, and the boundary of the insulating layer is within a boundary of the photonic die.